The Business Research Company’s 3D IC And 2.5D IC Packaging Global Market Report 2023 is the most detailed report available on the market, including broad forecast periods and multiple geographies. The report covers the historic period – 2010-2021, and the forecast period – 2023-2032. The 3D IC And 2.5D IC Packaging Global Market Report 2023 evaluates 3D IC and 2.5D IC packaging market size, growth rate, drivers, trends, and major companies.
Asia-Pacific was the largest region in the 3D IC and 2.5D IC market in 2022.
The report provides a global perspective by covering 60 geographies and focusing on major economies in each region – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
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The global 3D IC and 2.5D IC packaging market is expected to grow from $43.32 billion in 2022 to $48.60 billion in 2023 at a compound annual growth rate (CAGR) of 12.2%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The 3D IC and 2.5D IC packaging market is expected to reach $73.58 billion in 2027 at a CAGR of 10.9%.
The 3D IC and 2.5D IC packaging market segments in the report are:
By Technology:
3D Wafer-Level Chip-Scale Packaging
3D TSV (Through-Silicon Via)
2.5D
By Application:
Logic
Memory
Imaging And Optoelectronics
MEMS Or Sensors
LED
Other Applications
By End-user:
Telecommunication
Consumer Electronics
Automotive
Military And Aerospace
Medical Devices
Smart Technologies
Other End Users
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Top Major Companies
Samsung Electronics Co. Ltd.
Siemens AG
Intel Corporation
Taiwan Semiconductor Manufacturing Company Limited
SK Hynix Inc.
The table of contents in TBRC’s 3D IC and 2.5D IC packaging market report includes:
- Executive Summary
2. 3D IC And 2.5D IC Packaging Market Characteristics
3. 3D IC And 2.5D IC Packaging Market Trends And Strategies
4. 3D IC And 2.5D IC Packaging Market – Macro Economic Scenario
5.1. Global 3D IC And 2.5D IC Packaging Historic Market Size and Growth, 2017 – 2022, Value ($ Billion)
………………
32. Global 3D IC And 2.5D IC Packaging Market Competitive Benchmarking
33. Global 3D IC And 2.5D IC Packaging Market Competitive Dashboard
34. Key Mergers And Acquisitions In The 3D IC And 2.5D IC Packaging Market
35. 3D IC And 2.5D IC Packaging Market Future Outlook and Potential Analysis
36. Appendix
……………………
Table 1: Global Historic Market Growth, 2017-2022, $ Billion
Table 2: Global Forecast Market Growth, 2022-2027F, 2032F, $ Billion
Table 3: Global 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
Table 4: Global 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
Table 5: Global 3D IC And 2.5D IC Packaging Market, Segmentation By End-user, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion
……………………..
Table 74: Samsung Electronics Co. Ltd. Financial Performance
Table 75: Siemens AG Financial Performance
Table 76: Intel Corporation Financial Performance
Table 77: Taiwan Semiconductor Manufacturing Company Limited Financial Performance
Table 78: SK Hynix Inc. Financial Performance
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