The semiconductor assembly and testing services global market report 2024 from The Business Research Company provides comprehensive market statistics, including global market size, regional shares, competitor market share, detailed segments, trends, and opportunities. This report offers an in-depth analysis of current and future industry scenarios, delivering a complete perspective for thriving in the industrial automation software market.
Semiconductor Assembly And Testing Services Market, 2024 report by The Business Research Company offers comprehensive insights into the current state of the market and highlights future growth opportunities.
Market Size –
The semiconductor assembly and testing services market size has grown strongly in recent years. It will grow from $32.78 billion in 2023 to $34.94 billion in 2024 at a compound annual growth rate (CAGR) of 6.6%. The growth in the historic period can be attributed to the widespread adoption of smartphones and tablets, growth in consumer electronics, increasing globalization, need for innovative packaging solutions, increasing adoption of advanced packaging technologies.
The semiconductor assembly and testing services market size is expected to see strong growth in the next few years. It will grow to $45.67 billion in 2028 at a compound annual growth rate (CAGR) of 6.9%. The growth in the forecast period can be attributed to continuous innovation in semiconductor technologies, deployment of 5G networks, the proliferation of Internet of Things (IoT) devices, rise of electric vehicles, popularity of wearable devices. Major trends in the forecast period include the proliferation of the Internet of Things (IoT), the rollout of 5G networks, the automotive industry’s transition toward electric vehicles (EVs), continued expansion of cloud computing infrastructure, and increasing adoption of renewable energy technologies.
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Scope Of Semiconductor Assembly And Testing Services Market
The Business Research Company’s reports encompass a wide range of information, including:
1. Market Size (Historic and Forecast): Analysis of the market’s historical performance and projections for future growth.
2. Drivers: Examination of the key factors propelling market growth.
3. Trends: Identification of emerging trends and patterns shaping the market landscape.
4. Key Segments: Breakdown of the market into its primary segments and their respective performance.
5. Focus Regions and Geographies: Insight into the most critical regions and geographical areas influencing the market.
6. Macro Economic Factors: Assessment of broader economic elements impacting the market.
Semiconductor Assembly And Testing Services Market Overview
Market Drivers –
Major Driver Impacting Market Growth
Market Trends –
Major companies operating in the semiconductor assembly and testing services market focus on artificial intelligence (AI)-powered software solutions to accelerate yield improvement throughout integrated circuit (IC) engineering and production processes. The AI-powered software is tailored for yield improvement in IC engineering and production processes and offers semiconductor manufacturers a powerful tool to enhance operational efficiency, increase yield rates, and drive continuous improvement initiatives. For instance, in November 2022, Advantest Corporation, a Japan-based automatic test equipment manufacturer for the semiconductor industry, launched ACS EASY, a unique AI-powered, user-friendly software solution. It enhances productivity across device engineering and production operations, catering to various users, ranging from chip designers to outsourced semiconductor assembly and testing (OSAT) companies. The innovative ACS EASY application employs artificial intelligence to autonomously oversee test conditions and deduce potential causes of yield degradation, facilitating the isolation and analysis of underlying issues in production.
The semiconductor assembly and testing services market covered in this report is segmented –
1) By Service: Assembly And Packaging Services, Testing Services
2) By Packaging Technology: Flip-Chip, Wire Bond, Other Packaging Technologies
3) By End Use Industry: Telecommunication, Computing And Networking, Consumer Electronics, Industrial, Automotive Electronics, Other End-Use Industries
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Regional Insights –
Asia-Pacific was the largest region in the semiconductor assembly and testing services market in 2023. The regions covered in the semiconductor assembly and testing services market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Key Companies –
Major companies operating in the semiconductor assembly and testing services market are Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company, Intel Corporation, Micron Technology Inc., ASE Technology Group, QUALCOMM Inc., Amkor Technology Inc., Teledyne Technologies Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Siliconware Precision Industries Co. Ltd., Tianshui Huatian Technology Co. Ltd, Global Foundries Inc., Integrated Microelectronics Inc., King Yuan Electronics Corp., STATS chipPAC Ltd., ChipMOS Technologies INC., Chipbond Technology Corporation, UTAC Holdings Ltd., Unisem Group, Formosa Advanced Technologies Co. Ltd, Walton Advanced Engineering Inc., Lingsen Precision Industries Ltd., Integra Technologies LLC, Greatek Electronics Inc., CORWIL Technology Corp.
Table of Contents
1. Executive Summary
2. Semiconductor Assembly And Testing Services Market Report Structure
3. Semiconductor Assembly And Testing Services Market Trends And Strategies
4. Semiconductor Assembly And Testing Services Market – Macro Economic Scenario
5. Global Semiconductor Assembly And Testing Services Market Size and Growth
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32. Global Semiconductor Assembly And Testing Services Market Competitive Benchmarking
33. Global Semiconductor Assembly And Testing Services Market Competitive Dashboard
34. Key Mergers And Acquisitions In The Semiconductor Assembly And Testing Services Market
35. Semiconductor Assembly And Testing Services Market Future Outlook and Potential Analysis
36. Appendix
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