The Business Research Company’s report on the Chemical Mechanical Polishing Market provides insights into the global market size, growth rate, regional distribution, competitive landscape, key segments, emerging trends, and strategic opportunities.
How are market drivers shaping the future growth trajectory of the chemical mechanical polishing industry?
The expansion in consumer electronics industry is expected to propel the growth of the chemical mechanical polishing market going forward. Consumer electronics are electronic devices such as smartphones, tablets, laptops, TVs, gaming consoles, and wearable devices bought for personal rather than commercial use. The expansion in the consumer electronics industry is mostly driven by population growth, rising incomes, urbanization, and increasing demand for connectivity and mobility. CMP plays a crucial role in meeting the growing demand for consumer electronics by producing advanced electronic components with high precision and accuracy. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, the total electronic equipment production in Japan reached $52,36,535 million (¥771,457 million). In addition, consumer electronics production reached $2,178,430 million (¥32,099 million) in May 2023, compared to $1,714,724 million (¥25,268 million) in May 2022. Therefore, the expansion in the consumer electronics industry is driving the growth of the chemical mechanical polishing market.
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What is the estimated market size of the chemical mechanical polishing sector by 2029, based on current forecasts?
The chemical mechanical polishing market size has grown strongly in recent years. It will grow from$6 billion in 2024 to $6.46 billion in 2025 at a compound annual growth rate (CAGR) of 7.7%. The growth in the historic period can be attributed to automotive industry growth, aerospace sector expansion, demand for customization, efficiency and productivity gains, globalization of manufacturing, increase in mass production
The chemical mechanical polishing market size is expected to see strong growth in the next few years. It will grow to “$8.71 billion in 2029 at a compound annual growth rate (CAGR) of 7.7%. The growth in the forecast period can be attributed to additive manufacturing integration, renewable energy sector expansion, advanced materials machining, global infrastructure development, focus on sustainable manufacturing. Major trends in the forecast period include industry 4.0 integration, multi-tasking and multi-function machines, precision and high-speed machining, digital twin technology, open architecture control system, customization for specific industries.
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#Who are the top players in the chemical mechanical polishing market?
Major companies operating in the chemical mechanical polishing market include Ebara Corporation, Applied Materials Inc., Cabot Microelectronics Corporation, Lapmaster Wolters GmbH, Fujimi Incorporated, CMC Materials Inc., Hitachi Chemical Company Ltd., Badische Anilin- und Sodafabrik SE, Samsung Electronics Co. Ltd., Revasum Inc., Versum Materials Inc., Evonik Industries AG, Asahi Glass Corporation, DuPont de Nemours Inc., Ferro Corporation, 3A Composites India Private Limited, HKC Vietnam Company Limited, Logitech International SA, Tianjin Huahaiqingke, Tokyo Seimitsu Co. Ltd., K.C. Tech Co. Ltd., IV Technologies Inc., Merck Group, Solvay S.A., Air Products and Chemicals Inc., Entegris Inc., Okamoto Corporation, Compagnie de Saint-Gobain S.A., Dow Inc., LAM Research Corporation
#What are the major trends in the chemical mechanical polishing market?
Expansion of production and investment have emerged as key trends gaining popularity in the chemical mechanical polishing market. Major market players are concentrating their efforts on increasing production capacity to strengthen their position in the market. For instance, in September 2022, Showa Denko Materials Co. Ltd., a Japan-based chemical company, announced the expansion of its chemical mechanical polishing slurry production capacity, investing 20 billion yen across plants in Japan and Taiwan to meet rising semiconductor demands and advance material development for cutting-edge devices. Showa Denko Materials is set to bolster its production capacity and advancements for CMP slurries, aiming to address growing demand and the escalating requirements for enhanced functionality in advanced semiconductor devices. This initiative anticipates augmenting the Showa Denko Materials Group’s CMP slurry production by approximately 20%.
Which geography holds the highest chemical mechanical polishing market share?
Asia-Pacific was the largest region in the chemical mechanical polishing market in 2024. The regions covered in the chemical mechanical polishing market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa
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How do different segments contribute to the overall expansion of the chemical mechanical polishing market?
The chemical mechanical polishing market covered in this report is segmented –
1) By Type: CMP Equipment, CMP Consumable, Slurry, PAD, PAD Conditioner, Other Consumable Types
2) By Equipment: Polishing and Grinding, Slurry Testing
3) By Technology: Leading Edge, More than Moore’s, Emerging
4) By Application: Compound Semiconductors, Integrated Circuits, MEMS (microelectromechanical systems) and NEMS (nanoelectromechanical systems), Other Applications
Subsegments:
1) By CMP Equipment: Single-Station CMP Equipment, Multi-Station CMP Equipment, Inline CMP Equipment
2) By CMP Consumable: Slurry Filters, Polishing Pads, CMP Tools
3) By Slurry: Oxide Slurry, Non-Oxide Slurry, Advanced Slurry Systems
4) By PAD: Standard Polishing Pads, Advanced Polishing Pads, Specialized Polishing Pads
5) By PAD Conditioner: Mechanical Pad Conditioners, Chemical Pad Conditioners
6) By Other Consumable Types: Cleaning Agents, Dressing Tools, Other Related Consumables
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How is the chemical mechanical polishing market defined?
Chemical Mechanical Polishing (CMP) refers to a semiconductor manufacturing process that involves smoothing and planar zing the surfaces of semiconductor wafers. It is commonly used to remove unwanted material from the wafer surface, such as roughness, topography, and defects, and to create a flat and smooth surface.
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