The Atomic Layer Deposition by The Business Research Company provides market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, the Middle East, and Africa, encompassing 27 major global industries. The report presents a comprehensive analysis over a ten-year historic period (2010-2021) and extends its insights into a ten-year forecast period (2023-2033).
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According to The Business Research Company’s Atomic Layer Deposition, The atomic layer deposition market size has grown strongly in recent years. It will grow from $2.74 billion in 2023 to $2.99 billion in 2024 at a compound annual growth rate (CAGR) of 8.9%. The growth in the historic period can be attributed to semiconductor industry growth, r&d investments, miniaturization trends, increasing applications, material innovation, global expansion.
The atomic layer deposition market size is expected to see strong growth in the next few years. It will grow to $4.17 billion in 2028 at a compound annual growth rate (CAGR) of 8.7%. The growth in the forecast period can be attributed to medical device innovations, ai and machine learning integration, energy storage solutions, strategic alliances and collaborations, regulatory support. Major trends in the forecast period include advancements in nanotechnology, focus on energy storage, global expansion of ald equipment manufacturers, emergence of new applicationsintegration of ald in 3d nand technology, technological innovations.
Growing demand for semiconductor chips is expected to propel the growth of the atomic layer deposition market going forward. A semiconductor chip refers to an electric circuit with components including transistors and wiring formed on a semiconductor wafer. The manufacture of semiconductor chips and devices uses atomic layer deposition (ALD) to deposit layers of semiconductors on another semiconductor surface, therefore reducing or replacing the need for patterning stages. For instance, according to the Semiconductor Industry Association (SIA), a US-based trade association and lobbying group that represents the United States semiconductor industry, global semiconductor industry sales increased by 3.2 percent from $555.9 billion in 2021 to $573.5 billion in 2022. Therefore, the growing demand for semiconductor chips is driving the growth of the atomic layer deposition market.
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The atomic layer deposition market covered in this report is segmented –
1) By Type: Metal ALD, Aluminum oxide ALD, Plasma Enhanced ALD, Catalytic ALD, Other Types
2) By Process: Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD)
3) By End User: Semiconductors And Electronics, Chemicals, Energy, Healthcare, Other End Users
Product innovation is the key trend gaining popularity in the atomic layer deposition market. Major players operating in the atomic layer deposition market are focusing on developing atomic layer deposition platforms for new applications. For instance, in October 2022, Samco Inc., a Japan-based manufacturer of semiconductor process equipment for the fabrication of electronic components and nano-scale devices, launched a new plasma-enhanced atomic layer deposition (PEALD) system, AD-800LP. The system’s primary objective is to depose gate oxide films for the next generation of silicon carbide (SiC) and gallium nitride (GaN) power devices, which will be crucial in the transition to carbon neutrality. In addition to the traditional thermal ALD capability, the plasma-enhanced ALD system AD-800LP is a multi-purpose R&D system outfitted with a particular ICP plasma source named Tornado ICP. Tornado ICP, a Samco-exclusive plasma technology that differs from distant plasma, permits the deposition of diverse films using the AD-800LP, including oxide and nitride films. Tornado ICP allows steady plasma discharge for ALD deposition even at high pressures.
The atomic layer deposition market report table of contents includes:
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