The fan-out wafer level packaging global market report 2024 from The Business Research Company provides comprehensive market statistics, including global market size, regional shares, competitor market share, detailed segments, trends, and opportunities. This report offers an in-depth analysis of current and future industry scenarios, delivering a complete perspective for thriving in the industrial automation software market.
Fan-Out Wafer Level Packaging Market, 2024 report by The Business Research Company offers comprehensive insights into the current state of the market and highlights future growth opportunities.
Market Size –
The fan-out wafer level packaging market size has grown rapidly in recent years. It will grow from $2.13 billion in 2023 to $2.43 billion in 2024 at a compound annual growth rate (CAGR) of 14.1%. The growth in the historic period can be attributed to miniaturization of electronics, increased integration, improved electrical performance, global expansion.
The fan-out wafer level packaging market size is expected to see rapid growth in the next few years. It will grow to $3.94 billion in 2028 at a compound annual growth rate (CAGR) of 12.8%. The growth in the forecast period can be attributed to 5g and iot growth, artificial intelligence (ai) and high-performance computing, advances in materials, supply chain growth. Major trends in the forecast period include 3d integration, advanced packaging technologies, heterogeneous integration, cross-industry collaboration.
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Scope Of Fan-Out Wafer Level Packaging Market
The Business Research Company’s reports encompass a wide range of information, including:
- Market Size (Historic and Forecast): Analysis of the market’s historical performance and projections for future growth.
- Drivers: Examination of the key factors propelling market growth.
- Trends: Identification of emerging trends and patterns shaping the market landscape.
- Key Segments: Breakdown of the market into its primary segments and their respective performance.
- Focus Regions and Geographies: Insight into the most critical regions and geographical areas influencing the market.
- Macro Economic Factors: Assessment of broader economic elements impacting the market.
Fan-Out Wafer Level Packaging Market Overview
Market Drivers –
5G technology adoption in emerging countries is expected to propel the growth of the fan-out wafer-level packaging market in the coming future. 5G is the fifth generation of cellular network technology designed to increase speed, reduce latency and improve the flexibility of wireless services. Fan-out wafer-level packaging helps 5G technology by providing shorter interconnects and reduced inductance, enhancing RF and millimeter-wave performance. For instance, in April 2023, according to 5G Americas, a US-based trade association representing major telecom companies, between the end of 2021 and the end of 2022, global 5G wireless internet connections ascended by 76%, reaching 1.05 billion. Further, North America leads the way in wireless 5G connection adoption, reaching 507 million Volte and 119 million 5G connections expected by the end of the fourth quarter of 2022. Therefore, 5G technology adoption in emerging countries is driving the fan-out wafer-level packaging market.
Market Trends –
Major companies operating in the fan-out wafer-level packaging market are focusing on advanced next-generation graphics DRAM technology to provide reliable services to customers. Next-generation graphics DRAM technology refers to evolving and improving memory components specifically designed for graphics processing units (GPUs) and other graphics-intensive applications. For instance, in November 2022, Samsung Electronics Co. Ltd., a South Korea-based consumer electronics company, launched GDDR6W, the industry’s first next-generation graphics DRAM technology with doubled capacity and performance based on cutting-edge fan-out wafer-level packaging (FOWLP) technology. This significantly increases memory bandwidth and capacity with immense performance, massive storage and extensive bandwidth memory technologies that are assisting in bringing the virtual realm closer to reality.
The fan-out wafer level packaging market covered in this report is segmented –
1) By Process Type: Standard-Density Packaging; High-Density Packaging; Bumping
2) By Business Model: Outsourced Semiconductor Assembly and Test (OSAT); Foundry; Integrated Device Manufacturer (IDM)
3) By Application: Consumer Electronics; Industrial; Automotive; Healthcare; Aerospace And Defense; IT And Telecommunication; Other Applications
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Regional Insights –
Asia-Pacific was the largest region in the fan-out wafer level packaging market in 2023. The regions covered in fan-out wafer level packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.
Key Companies –
Major players in the fan-out wafer level packaging market are Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, Qualcomm Inc., Fujitsu Limited, Toshiba Corporation, Applied Materials Inc., ASE Technology Holding Co. Ltd., Texas Instruments Incorporated, Lam Research Corporation, STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., Microchip Technology Inc., Synopsys Inc., Xilinx Inc., Siliconware Precision Industries Co Ltd., Onto Innovation Inc., Unisem Group, Nepes Corporation, Deca Technologies Inc., Yield Engineering Systems Inc., Powertech Technology Inc., Jiangsu Changdian Technology Co. Ltd., Yole Group.
Table of Contents
- Executive Summary
- Fan-Out Wafer Level Packaging Market Report Structure
- Fan-Out Wafer Level Packaging Market Trends And Strategies
- Fan-Out Wafer Level Packaging Market – Macro Economic Scenario
- Fan-Out Wafer Level Packaging Market Size And Growth
…..
- Fan-Out Wafer Level Packaging Market Competitor Landscape And Company Profiles
- Key Mergers And Acquisitions
- Future Outlook and Potential Analysis
- Appendix
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