The Business Research Company’s report on the Flip Chip Market provides insights into the global market size, growth rate, regional distribution, competitive landscape, key segments, emerging trends, and strategic opportunities.
How are market drivers shaping the future growth trajectory of the flip chip industry?
The increase in sales of electronic products will propel the growth of the flip chips market during the forecast period. Flip chips are used in electronic equipment as it improves the presentation of portable electrical devices that operate at higher frequencies, allowing for greater use in ultrasonic and microwave operations. The technology exhibits high overall system efficiency and low inductance while taking up less space. According to Gartner, a US-based consulting firm estimated that the installed base of devices worldwide is expected to reach 6.4 billion units in 2022, an increase of 3.2% from 2021. Therefore, the increase in sales of electronic products drives growth in the flip chips market.
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What is the estimated market size of the flip chip sector by 2029, based on current forecasts?
The flip chip market size has grown rapidly in recent years. It will grow from $38.25 billion in 2024 to $42.3 billion in 2025 at a compound annual growth rate (CAGR) of 10.6%. The growth in the historic period can be attributed to miniaturization and size reduction, improved electrical performance, consumer electronics growth, improved heat dissipation, increased speed and data transmission.
The flip chip market size is expected to see rapid growth in the next few years. It will grow to $66.24 billion in 2029 at a compound annual growth rate (CAGR) of 11.9%. The growth in the forecast period can be attributed to automotive electronics, high-density interconnects, heterogeneous integration, 3D ic integration, semiconductor material advancements. Major trends in the forecast period include 5g and high-performance computing, internet of things (iot) expansion, advanced packaging technologies, ai and machine learning acceleration, quantum computing.
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#Who are the top players in the flip chip market?
Major companies operating in the flip chip market include 3M Company, Advanced Micro Devices Inc., Amkor Technology Inc., Apple Inc., Fujitsu Limited., Intel Corporation, International Business Machines Corporation, Samsung Electronics Co. Ltd., Texas Instruments Incorporated, ASE Technology Holding Co. Ltd., Chipbond Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd, Siliconware Precision Industries Co. Ltd., Unimicron Technology Corporation, Ibiden Co. Ltd., Nan Ya Printed Circuit Board Corporation, Shiko Electric Industries Co. Ltd., Austria Technologie & Systemtechnik AG, Kinsus Interconnect Technology Corporation, STATS ChipPAC Pte. Ltd., Powertech Technology Inc., UTAC Holdings Ltd, Taiwan Semiconductor Manufacturing Co., TF-AMD Microelectronics Sdn Bhd., Zhen Ding Technology Holding Ltd., Engent Inc., Masterwork Electronics, Advotech Company Inc., First Level Inc., Flipchip International LLC, Cormetech Inc.
#What are the major trends in the flip chip market?
Technological advancement is a key trend gaining popularity in the flip chip market. Companies in the flip chip market are focusing on developing technologies to strengthen their position in the market. For instance, In September 2023, Dahua, a China-based company specializing in video surveillance solutions, announced the launch of New Flip COB Chip LED Display, the CH II, this display utilizes Flip Chip on Board (COB) technology, which enhances visual quality by providing softer, pixel-free illumination, helping to reduce digital visual fatigue.
Which geography holds the highest flip chip market share?
Asia-Pacific was the largest region in the flip chip market in 2024 and is expected to be the fastest-growing region in the forecast period. The regions covered in the flip chip market report include Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.
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How do different segments contribute to the overall expansion of the flip chip market?
The flip chip market covered in this report is segmented –
1) By Packaging Technology: 3D IC, 2.5D IC, 2D IC
2) By Bumping Technology: Copper Pillar, Solder Bumping, Tin-Lead Eutectic Solder, Lead-Free Solder
3) By Industry: Electronics, Heavy Machinery and Equipment, IT and Telecommunication, Automotive, Other Industries
Subsegments:
1) By 3D IC: Through-Silicon Via (TSV), Stacked Die Packaging
2) By 2.5D IC: Interposer Technology, Silicon Interposer
3) By 2D IC: Wire Bonding, Flip Chip Direct Attach
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How is the flip chip market defined, and what are its core characteristics?
Flip chips are also known as direct chip attach where interconnecting dies such as semiconductor devices, IC chips, integrated passive devices, and microelectromechanical systems (MEMS) are attached bond pad side down to a substrate or carrier. These have numerous benefits, such as lower cost, high packaging density, improved circuit reliability, and small dimensions. It is used in the flip-chip packaging process to link the chip and the substrate of a package carrier. Any surface of a flip chip can be interconnected, typically with copper, nickel, or soldered metal bumps. These bumps are installed on the die surface and aid in the electrical connection between the device and the box substrate.
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