Industry

Flip Chip Technology Market Size, CAGR, Trends 2024 …

The Flip Chip Global Market Report 2024 by The Business Research Company provides market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, the Middle East, and Africa, encompassing 27 major global industries. The report presents a comprehensive analysis over a ten-year historic period (2010-2021) and extends its insights into a ten-year forecast period (2023-2033).

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According to The Business Research Company’s Flip Chip Global Market Report 2024, The flip chip market size has grown rapidly in recent years. It will grow from $34.9 billion in 2023 to $38.88 billion in 2024 at a compound annual growth rate (CAGR) of 11.4%. The growth in the historic period can be attributed to miniaturization and size reduction, improved electrical performance, consumer electronics growth, improved heat dissipation, increased speed and data transmission.

The flip chip market size is expected to see rapid growth in the next few years. It will grow to $60.48 billion in 2028 at a compound annual growth rate (CAGR) of 11.7%. The growth in the forecast period can be attributed to automotive electronics, high-density interconnects, heterogeneous integration, 3d ic integration, semiconductor material advancements. Major trends in the forecast period include 5g and high-performance computing, internet of things (iot) expansion, advanced packaging technologies, ai and machine learning acceleration, quantum computing.

The increase in sales of electronic products will propel the growth of the flip chips market during the forecast period. Flip chips are used in electronic equipment as it improves the presentation of portable electrical devices that operate at higher frequencies, allowing for greater use in ultrasonic and microwave operations. The technology exhibits high overall system efficiency and low inductance while taking up less space. According to Gartner, a US-based consulting firm estimated that the installed base of devices worldwide is expected to reach 6.4 billion units in 2022, an increase of 3.2% from 2021. Therefore, the increase in sales of electronic products drives growth in the flip chips market.

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The flip chip market covered in this report is segmented –

1) By Packaging Technology: 3D IC, 2.5D IC, 2D IC

2) By Bumping Technology: Copper Pillar, Solder Bumping, Tin-Lead Eutectic Solder, Lead-Free Solder

3) By Industry: Electronics, Heavy Machinery and Equipment, IT and Telecommunication, Automotive, Other Industries

Technological advancement is a key trend gaining popularity in the flip chip market. Companies in the flip chip market are focusing on developing technologies to strengthen their position in the market. For instance, In August 2021, ACM Research Inc., a US-based single-wafer wet cleaning equipment company, announced the launch of ACM’s Ultra ECP GIII plating tool to support wafer-level packaging (WLP) including, product offers for silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide for compound semiconductors (GaAs). The tool can plate gold (Au) into backside deep hole processes with uniformity and step coverage.

The flip chip market report table of contents includes: