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Global 3D IC And 2.5D IC Packaging Market Size and Forecast 2024-2033|Samsung Electronics Co. Ltd., Siemens AG, Intel Corporation, Taiwan Semiconductor Manufacturing Company Limited, SK Hynix Inc

The 3D IC And 2.5D IC Packaging Global Market Report 2024 by The Business Research Company provides market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, the Middle East, and Africa, encompassing 27 major global industries. The report presents a comprehensive analysis over a ten-year historic period (2010-2021) and extends its insights into a ten-year forecast period (2023-2033).

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According to The Business Research Company’s 3D IC And 2.5D IC Packaging Global Market Report 2024, The 3d ic and 2.5d ic packaging market size has grown rapidly in recent years. It will grow from $48.6 billion in 2023 to $54.39 billion in 2024 at a compound annual growth rate (CAGR) of 11.9%. The growth in the historic period can be attributed to miniaturization of electronic devices, demand for improved power efficiency, demand for improved signal integrity, demand for consumer electronics and gaming devices, performance enhancement.

The 3d ic and 2.5d ic packaging market size is expected to see rapid growth in the next few years. It will grow to $81.67 billion in 2028 at a compound annual growth rate (CAGR) of 10.7%. The growth in the forecast period can be attributed to emergence of wearable and portable devices, growing need for energy efficiency, rising demand for high-performance computing (hpc), shift toward system-on-chip (soc) designs, increasing complexity of semiconductor devices, iot proliferation. Major trends in the forecast period include 5g technology advacements , advanced interconnect technologies, industry collaboration and standards, technological advancements in semiconductor technology, innovation in packaging materials.

The growing demand for consumer electronics is expected to propel the growth of the 3D IC and 2.5D IC packaging market going forward. Consumer electronics refers to any electronic equipment created to be bought and utilized by consumers or end users for personal, daily, and non-commercial uses. 3D IC (Integrated Circuit) and 2.5D IC packaging are advanced packaging technologies that offer enhanced performance, increased functionality, and the miniaturization of electronic devices. The growing demand for consumer electronics and gaming devices is driven by technological advancements, increasing disposable income, gaming industry expansion, digital transformation, remote work, and entertainment trends, changing lifestyles and preferences, and the influence of social media and content consumption. For instance, in January 2023, according to the annual financial report 2022 published by LG, a South Korea-based consumer electronics company, the sales for 2022 witnessed a growth of 12.9% compared to the previous year, when sales surpassed approximately $52.70 billion. Further, the LG Home Appliance & Air Solution Company also recorded another record-breaking year with a revenue of $22.5 billion in 2022, marking a 10.3% increase from the previous year. Therefore, the growing demand for consumer electronics is driving the growth of the 3D IC and 2.5D IC packaging market.

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The 3d ic and 2.5d ic packaging market covered in this report is segmented –

1) By Technology: 3D Wafer-Level Chip-Scale Packaging, 3D TSV (Through-Silicon Via), 2.5D

2) By Application: Logic, Memory, Imaging And Optoelectronics, MEMS Or Sensors, LED, Other Applications

3) By End-user: Telecommunication, Consumer Electronics, Automotive, Military And Aerospace, Medical Devices, Smart Technologies, Other End Users

Technological advancements are a key trend gaining popularity in the 3D IC and 2.5D IC packaging market. Major companies operating in the 3D IC and 2.5D IC packaging market are adopting new technologies to sustain their position in the market. For instance, in June 2022, ASE Technology Holding Co. Ltd., a Taiwan-based provider of semiconductor manufacturing services, launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. It is the next generation of 3D heterogeneous integration architecture from ASE that expands design guidelines and delivers exceptionally high performance and density. The platform enables companies to achieve unparalleled creativity when integrating several chips into a single package. It utilizes advanced redistribution layer (RDL) technologies, embedded integration, and 2.5D and 3D technologies. Six fundamental packaging technology pillars comprise ASE’s VIPack, complemented by a wide-ranging co-design ecosystem. These include ASE’s high-density through Silicon Via (TSV)-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities, as well as Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP)-based technologies.

The 3d ic and 2.5d ic packaging market report table of contents includes:

1. Executive Summary

2. 3D IC And 2.5D IC Packaging Market Characteristics

3. 3D IC And 2.5D IC Packaging Market Trends And Strategies

4. 3D IC And 2.5D IC Packaging Market – Macro Economic Scenario

5. Global 3D IC And 2.5D IC Packaging Market Size and Growth

26. South America 3D IC And 2.5D IC Packaging Market

27. Brazil 3D IC And 2.5D IC Packaging Market

28. Middle East 3D IC And 2.5D IC Packaging Market

29. Africa 3D IC And 2.5D IC Packaging Market

30. 3D IC And 2.5D IC Packaging Market Competitive Landscape And Company Profiles

Top Major Players: