Categories: Market Research

Global Molded Interconnect Device Market Growth Prospects, Future Industry Landscape 2032 | Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe

The Business Research Company’s Molded Interconnect Device (MID) Global Market Report 2023 is the most detailed report available on the market, including broad forecast periods and multiple geographies. The report covers the historic period – 2010-2021, and the forecast period – 2023-2032. The Molded Interconnect Device (MID) Global Market Report 2023 evaluates molded interconnect device (MID) market size, growth rate, drivers, trends, and major companies.

The report provides a global perspective by covering 60 geographies and focusing on major economies in each region – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

Request A Free Sample Of The Report (Includes Graphs And Tables):

https://www.thebusinessresearchcompany.com/sample.aspx?id=8856&type=smp

The global molded interconnect device market is expected to grow from $1.53 billion in 2022 to $1.78 billion in 2023 at a compound annual growth rate (CAGR) of 16.1%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic, at least in the short term. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The molded interconnect device market is expected to grow to $3.16 billion in 2027 at a CAGR of 15.4%.

The molded interconnect device (MID) market segments in the report are:

1) By Product: Antenna and Connectivity Modules, Connectors and Switches, Sensors, Lighting

2) By Process: Laser Direct Structuring (LDS), Two-shot molding, Other Processes

3) By Application: Automotive, Consumer products, Healthcare, Industrial, Military and aerospace, Telecommunication And Computing

Top Key Players

  • Molex LLC
  • TE Connectivity
  • Amphenol Corporation
  • LPKF Laser & Electronics AG
  • 2E mechatronic GmbH & Co. KG

Get More Information On The Molded Interconnect Device (MID) Market Report:

https://www.thebusinessresearchcompany.com/report/molded-interconnect-device-MID-global-market-report

The table of contents in TBRC’s molded interconnect device (MID) market report includes:

  1. Executive Summary
  2. Molded Interconnect Device (MID) Market Characteristics
  3. Molded Interconnect Device (MID) Market Trends And Strategies
  4. Molded Interconnect Device (MID) Market – Macro Economic Scenario
  5. Molded Interconnect Device (MID) Market Size And Growth

.

  1. Molded Interconnect Device (MID) Market Competitive Landscape And Company Profiles
  2. Key Mergers And Acquisitions In The Molded Interconnect Device (MID) Market
  3. Molded Interconnect Device (MID) Market Future Outlook and Potential Analysis
  4. Appendix

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