The Organic Substrate Packaging Global Market Report 2023, provides comprehensive information on the organic substrate packaging market across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa for the 27 major global industries. The report covers a ten year historic period – 2010-2021, and a ten year forecast period – 2023-2032.
Learn More On The Organic Substrate Packaging Market’s Growth:
As per The Business Research Company’s Organic Substrate Packaging Global Market Report 2023, the global organic substrate packaging material market is expected to grow from $13.63 billion in 2022 to $14.33 billion in 2023 at a compound annual growth rate (CAGR) of 5.1%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic, at least in the short term. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The market size of global organic substrate packaging material market is expected to grow to $17.19 billion in 2027 at a CAGR of 4.7%.
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The organic substrate packaging material market is currently witnessing a notable surge in its trajectory, primarily attributed to the pervasive influence of technological advancements. Within this dynamic landscape, leading companies within the organic substrate packaging material domain have redirected their focus toward the cultivation of pioneering technological solutions with the overarching objective of bolstering their competitive standing. One salient exemplification of this commitment to innovation and progress emerges from Panasonic Holdings Corporation, an eminent Japan-based provider renowned for its expansive portfolio of industrial products and solutions, encompassing capacitors, packaging materials, and sensors, among others.
In a watershed moment in June 2021, Panasonic Holdings Corporation heralded the introduction of a groundbreaking substrate packaging material known as R-1515V. This innovative material is poised to redefine the landscape of assembly-level reliability, while concurrently mitigating the challenge of package warpage—a perennial concern within the industry. The newfound R-1515V presents a unique composition characterized by optimized mechanical properties, which exert a profound impact in reducing the residual stress incurred during reflow assembly, consequently enhancing the reliability quotient of integrated circuit (IC) chips.
Notably, the material’s mechanical prowess plays a pivotal role in alleviating the stressors afflicting solder joints. The conscious maneuver to reduce the residual stress incurred during reflow assembly serves as a pivotal enabler for augmenting the overall reliability of IC chips. It is an exemplar of precision engineering, wherein the integrity of the IC chips packaging process is buttressed by the judicious manipulation of thermal expansion rates. This innovation forms the cornerstone for addressing the critical challenge that has persistently beset the domain of IC chips packaging.
In summation, the advent of Panasonic Holdings Corporation’s R-1515V substrate packaging material ushers in a new era of technological progress within the organic substrate packaging material sector. This novel material promises to transcend conventional boundaries and redefine the principles governing assembly-level reliability, while simultaneously grappling with the perennial issue of package warpage. As the industry advances in its pursuit of innovation, it is evident that technological progress will continue to serve as the driving force, ushering in an era of enhanced IC chip packaging reliability, assembly efficiency, and reduced thermal expansion challenges.
The organic substrate packaging market is segmented:
1) By Technology: Small Outline (SO) Packages, Grid Array (GA) Packages, Flat No-Leads Packages, Quad Flat Package (QFP), Dual In-Line Package (DIP), Other Technologies
2) By Application: Consumer Electronics, Automotive, Manufacturing, Healthcare, Other Applications
3) By End-Use: Mobile Phones, FPD (Flat Panel Display), Other End-Uses
Asia-Pacific was the largest region in the organic substrate packaging market in 2022.
The table of contents in TBRC’s organic substrate packaging market report includes:
1. Executive Summary
2. Organic Substrate Packaging Material Market Characteristics
3. Organic Substrate Packaging Material Market Trends And Strategies
4. Organic Substrate Packaging Material Market – Macro Economic Scenario
5. Organic Substrate Packaging Material Market Size And Growth
…
27. Organic Substrate Packaging Material Market Competitive Landscape And Company Profiles
28. Key Mergers And Acquisitions In The Organic Substrate Packaging Material Market
29. Organic Substrate Packaging Material Market Future Outlook and Potential Analysis
30. Appendix
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