Global Wafer Processing Equipment Market Forecast 2024

The Semiconductor Fabrication Material Global Market Report 2024 by The Business Research Company provides market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, the Middle East, and Africa, encompassing 27 major global industries. The report presents a comprehensive analysis over a ten-year historic period (2010-2021) and extends its insights into a ten-year forecast period (2023-2033).

Learn More On The Semiconductor Fabrication Material Market:

https://www.thebusinessresearchcompany.com/report/semiconductor-fabrication-material-global-market-report

According to The Business Research Company’s Semiconductor Fabrication Material Global Market Report 2024, The semiconductor fabrication material market size has grown rapidly in recent years. It will grow from $60.85 billion in 2023 to $67.48 billion in 2024 at a compound annual growth rate (CAGR) of 10.9%. The growth in the historic period can be attributed to growth of the electronics industry, technological advancements in semiconductor materials, demand for smaller and more powerful chips, global consumer electronics market, increasing use of semiconductors in automotive, research and development in materials science..

The semiconductor fabrication material market size is expected to see rapid growth in the next few years. It will grow to $102.27 billion in 2028 at a compound annual growth rate (CAGR) of 11.0%. The growth in the forecast period can be attributed to transition to 5nm and below semiconductor nodes, 3d packaging and chip stacking, quantum materials and computing, demand for ai and iot chips, sustainable and eco-friendly materials, miniaturization and power efficiency.. Major trends in the forecast period include advanced materials for neuromorphic computing, use of 2d materials in semiconductors, monolithic 3d integration for chip stacking, euv lithography for finer features, in-memory computing materials, materials for neuromorphic and quantum computing..

The increasing investment in the energy sector is expected to propel the growth of the semiconductor fabrication materials market. Semiconductors are generally installed in the energy sector, such as solar panels, drives, and pumps in wind and water turbines, and protection circuits in energy conversion to ensure efficiency and minimal power loss. The government is abundantly investing in the energy sector. According to the International Energy Agency (IEA) investment report in 2022, a France-based autonomous intergovernmental organization for energy, the global energy investment is anticipated to increase by over 8% in 2022 to reach USD 2.4 trillion, a significant increase over pre-Covid levels. All areas of the energy sector are seeing an increase in investment, but in recent years the power sector – particularly in renewables and grids – and greater expenditure on end-use efficiency have seen the biggest gains. Therefore, the increasing investment in the energy sector is driving the growth of the semiconductor fabrication materials market.

Get A Free Sample Of The Report (Includes Graphs And Tables):

https://www.thebusinessresearchcompany.com/sample.aspx?id=6747&type=smp

The semiconductor fabrication material market covered in this report is segmented –

1) By Semiconductor Type: N-Type, P-Type

2) By Fabrication Material: Silicon wafers, Photomasks, Photoresists, Other Fabrication Materials

3) By End User: Telecommunication, Energy, Electrical and Electronics, Medical and Healthcare, Automotive, Defence and Aerospace, Other End Users

Product innovations have emerged as a key trend gaining popularity in the semiconductor fabrication material market. Companies operating in semiconductor fabrication materials are focused on developing innovative products to sustain their position in the market. For instance, in June 2021, Panasonic Corporation, a Japan-based manufacturer of electric and electronic products, launched a semiconductor package substrate material (Product No. R-1515V). This product enabled both low package warpage and high assembly-level reliability. The new material has very low thermal expansion properties that reduce the warping of the substrate during the packaging process and optimized mechanical properties that lower the residual stress on solder joints

The semiconductor fabrication material market report table of contents includes: