Overview and Scope
High-density interconnect (HDI) is a printed circuit board (PCB) that enables placing more components on the same board space. It is used to reduce the size of the PCB while adding more functionality and features to a single board.
Sizing and Forecast
The high density interconnect market size has grown rapidly in recent years. It will grow from $15.05 billion in 2023 to $16.71 billion in 2024 at a compound annual growth rate (CAGR) of 11.1%. The growth in the historic period can be attributed to miniaturization of electronics, consumer electronics boom, increase in mobile devices, performance enhancement, higher functionality requirements.
The high density interconnect market size is expected to see rapid growth in the next few years. It will grow to $24.82 billion in 2028 at a compound annual growth rate (CAGR) of 10.4%. The growth in the forecast period can be attributed to 5g technology implementation, rise in iot devices, emerging ai and machine learning applications, advancements in automotive electronics, growth in wearable devices. Major trends in the forecast period include technological advancements in pcb design, advancements in semiconductor technology, ultra-thin hdi solutions, increased layer count in hdi boards, rise in microvia technology.
To access more details regarding this report, visit the link:
https://www.thebusinessresearchcompany.com/report/high-density-interconnect-global-market-report
Segmentation & Regional Insights
The high density interconnect market covered in this report is segmented –
1) By Type: Single Panel, Double Panel, Other Types
2) By Substrate: Rigid, Flexible, Rigid-Flex
3) By End User: Automotive, Consumer Electronics, Telecommunications, Medical, Other End-Users
Asia-Pacific was the largest region in the high-density interconnect market in 2023 and is expected to be the fastest-growing region in the high-density interconnect market report during the forecast period. The regions covered in the high density interconnect market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Intrigued to explore the contents? Secure your hands-on sample copy of the report:
https://www.thebusinessresearchcompany.com/sample_request?id=12266&type=smp
Major Driver Impacting Market Growth
The increasing application of the automotive industry is expected to propel the growth of the high-density interconnect market going forward. The automotive industry is a sector that encompasses numerous organizations and firms involved in the design, development, manufacture, marketing, selling, and maintenance of motor vehicles. High-density interconnect (HDI) technology provides multiple benefits for the automobile industry in terms of improvement, higher performance, increased reliability, improved signal transfer, more minor elements, and price cuts. For instance, according to the Bureau of Transportation Statistics (BTS), a US-based agency that publishes information on transportation systems, new vehicle sales increased to 11,471 (Thousands of vehicles) in 2021. Therefore, the increasing application of the automotive industry drives the high-density interconnect market.
Key Industry Players
Major companies operating in the high density interconnect market report are Unimicron Technology Corporation, TTM Technologies Inc., Austria Technologie & Systemtechnik AG, Zhen Ding Tech. Group, Meiko Electronics Co. Ltd., Fujitsu Limited, Multek Corporation, NCAB Group, Sierra Circuits Inc., Ibiden Co. Ltd., Samsung Electro-Mechanics, Unitech Printed Circuit Board Corp., Empresa Provincial de Energía de Córdoba, CMK Corporation, Nan Ya Printed Circuit Board Corporation, RayMing Technology Co.Ltd., Advanced Circuits Inc., Calumet Electronics Corporation, ChinaPCBOne Technology Limited, Epec Engineered Technologies, Flex PCB Inc., Hemeixin Electronics Co. Limited, King Sun PCB Technology Co. Ltd., Moko Technology Limited, RUSH PCB Inc., XPCB Limited, Sunstone Circuits LLC, 3CEMS Group.
The high density interconnect market report table of contents includes:
1. Executive Summary
2. High Density Interconnect Market Characteristics
3. High Density Interconnect Market Trends And Strategies
4. High Density Interconnect Market – Macro Economic Scenario
5. Global High Density Interconnect Market Size and Growth
.
.
.
31. High Density Interconnect Market Other Major And Innovative Companies
32. Global High Density Interconnect Market Competitive Benchmarking
33. Global High Density Interconnect Market Competitive Dashboard
34. Key Mergers And Acquisitions In The High Density Interconnect Market
35. High Density Interconnect Market Future Outlook and Potential Analysis
36.Appendix
Explore the trending research reports from TBRC:
Contact Us:
The Business Research Company
Europe: +44 207 1930 708
Asia: +91 88972 63534
Americas: +1 315 623 0293
Email: [email protected]
Follow Us On:
LinkedIn: https://in.linkedin.com/company/the-business-research-company
Twitter: https://twitter.com/tbrc_info
Facebook: https://www.facebook.com/TheBusinessResearchCompany
YouTube: https://www.youtube.com/channel/UC24_fI0rV8cR5DxlCpgmyFQ
Blog: https://blog.tbrc.info/
Healthcare Blog: https://healthcareresearchreports.com/
Global Market Model: https://www.thebusinessresearchcompany.com/global-market-model
