Molded Interconnect Device Market Size, Share Report

The Molded Interconnect Device MID Global Market Report 2024 by The Business Research Company provides market overview across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, the Middle East, and Africa, encompassing 27 major global industries. The report presents a comprehensive analysis over a ten-year historic period (2010-2021) and extends its insights into a ten-year forecast period (2023-2033).

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According to The Business Research Company’s Molded Interconnect Device MID Global Market Report 2024, The molded interconnect device (mid) market size has grown rapidly in recent years. It will grow from $1.51 billion in 2023 to $1.77 billion in 2024 at a compound annual growth rate (CAGR) of 17.2%. The growth in the historic period can be attributed to miniaturization trends, consumer electronics evolution, automotive electronics development, medical device innovations, shift towards smart manufacturing..

The molded interconnect device (mid) market size is expected to see rapid growth in the next few years. It will grow to $3.27 billion in 2028 at a compound annual growth rate (CAGR) of 16.5%. The growth in the forecast period can be attributed to ongoing evolution of consumer electronics, rise in medical device integration, automotive electronics growth, rapid prototyping and manufacturing innovations.. Major trends in the forecast period include regulatory compliance and quality standards, customization and design flexibility, rapid prototyping and manufacturing technologies, sustainability and material innovations, industry 4.0 and smart manufacturing..

Growing demand for IoT devices is expected to propel the growth of the molded interconnect devices market going forward. IoT devices refer to the billions of physical items or things linked to the internet, all of which gather and exchange data with other devices and systems over the internet. The rising demand for the Internet of Things (IoT), quantum computing, and 5G, among other emerging technology segments, combined with the connected world’s increasing demand for higher computational speed and efficiency, low-power devices, and intelligent chipsets, has had a significant impact on the semiconductor & electronics industry dynamics. For instance, in August 2022, according to a blog released by Techjury, collected from IoT Analytics. The categories with the most real corporate IoT initiatives in development included Smart City (23%), Connected Industry (17%), and Connected Building (12%) and 97% of firms believe that producing value from IoT-related data is challenging. Therefore, the growing demand for IoT devices will drive the molded to interconnect devices market.

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The molded interconnect device (mid) market covered in this report is segmented –

1) By Product: Antenna and Connectivity Modules, Connectors and Switches, Sensors, Lighting

2) By Process: Laser Direct Structuring (LDS), Two-shot molding, Other Processes

3) By Application: Automotive, Consumer products, Healthcare, Industrial, Military and aerospace, Telecommunication And Computing

Technological development is the key trend gaining popularity in the molded interconnect device market. Major businesses involved in molded connection devices are concentrating on creating cutting-edge technological solutions that are adaptable to other aspects, which is what is causing technologies like laser plastic welding to develop. For instance, in November 2021, LPKF Laser & Electronics, a German-based electronics manufacturing company, developed a new technology by combining LDS and laser plastic welding. The LPKF laser plastic welding technology produces aesthetically and functionally superior weld seams for durable and dependable plastic couplings with virtually no design constraints. LPKF has created WeLDS, a revolutionary technique that blends 3D MIDs and laser plastic welding. This opens up hitherto unseen possibilities for function integration in electronics applications.

The molded interconnect device mid market report table of contents includes: