Molded Interconnect Device (MID) Market Report By Trends, Analysis And Global Outlook 2032 | Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG

The Molded Interconnect Device (MID) Global Market Report 2023, provides comprehensive information on the molded interconnect device (MID) market across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa for the 27 major global industries. The report covers a ten year historic period – 2010-2021, and a ten year forecast period – 2023-2032. 

Learn More On The Molded Interconnect Device (MID) Market’s Growth:
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As per The Business Research Company’s Molded Interconnect Device (MID) Global Market Report 2023, the  global molded interconnect device market is expected to grow from $1.53 billion in 2022 to $1.78 billion in 2023 at a compound annual growth rate (CAGR) of 16.1%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic, at least in the short term. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The molded interconnect device market is expected to grow to $3.16 billion in 2027 at a CAGR of 15.4%.

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The molded interconnect device (MID) market is segmented:
1) By Product: Antenna and Connectivity Modules, Connectors and Switches, Sensors, Lighting
2) By Process: Laser Direct Structuring (LDS), Two-shot molding, Other Processes
3) By Application: Automotive, Consumer products, Healthcare, Industrial, Military and aerospace, Telecommunication And Computing

Top Major Players 

Molex LLC
TE Connectivity
Amphenol Corporation
LPKF Laser & Electronics AG
2E mechatronic GmbH & Co. KG

Asia-Pacific was the largest region in the molded interconnect device (MID) market in 2022.

The table of contents in TBRC’s molded interconnect device (MID) market report includes:
1. Executive Summary
2. Molded Interconnect Device (MID) Market Characteristics
3. Molded Interconnect Device (MID) Market Trends And Strategies
4. Molded Interconnect Device (MID) Market – Macro Economic Scenario
5. Molded Interconnect Device (MID) Market Size And Growth
…………
26. Africa Molded Interconnect Device (MID) Market
27. Molded Interconnect Device (MID) Market Competitive Landscape And Company Profiles
28. Key Mergers And Acquisitions In The Molded Interconnect Device (MID) Market
29. Molded Interconnect Device (MID) Market Future Outlook and Potential Analysis
30. Appendix

List Of Tables 

Table 1: Global Historic Market Growth, 2017-2022, $ Billion 

Table 2: Global Forecast Market Growth, 2022-2027F, 2032F, $ Billion 

Table 3: Global Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion 

Table 4: Global Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion 

Table 5: Global Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2017-2022, 2022-2027F, 2032F, $ Billion 

…….
Table 46: Molex LLC Financial Performance 

Table 47: TE Connectivity Financial Performance 

Table 48: Amphenol Corporation Financial Performance 

Table 49: LPKF Laser & Electronics AG Financial Performance 

Table 50: 2E mechatronic GmbH & Co. KG Financial Performance

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