Overview and Scope
Organic substrate packaging material is a highly reliable and fine design rule used in semiconductor packaging. They are used as a foundation layer in the semiconductor.
Sizing and Forecast
The organic substrate packaging material market size has grown strongly in recent years. It will grow from $14.24 billion in 2023 to $15 billion in 2024 at a compound annual growth rate (CAGR) of 5.4%. The growth in the historic period can be attributed to consumer electronics boom, environmental concerns, regulatory standards, market competition, global economic trends..
The organic substrate packaging material market size is expected to see strong growth in the next few years. It will grow to $18.53 billion in 2028 at a compound annual growth rate (CAGR) of 5.4%. The growth in the forecast period can be attributed to electric vehicle market growth, circular economy initiatives, stringent environmental regulations, rising consumer electronics trends, supply chain resilience.. Major trends in the forecast period include integration of nanotechnology in packaging, expansion of applications in healthcare, innovation in material compositions, demand for high-performance and cost-effective solutions, next-gen technologies..
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The organic substrate packaging material market covered in this report is segmented –
1) By Technology: Small Outline (SO) Packages, Grid Array (GA) Packages, Flat No-Leads Packages, Quad Flat Package (QFP), Dual In-Line Package (DIP), Other Technologies
2) By Application: Consumer Electronics, Automotive, Manufacturing, Healthcare, Other Applications
3) By End-Use: Mobile Phones, FPD (Flat Panel Display), Other End-Uses
Asia-Pacific was the largest region in the organic substrate packaging material market share in 2023. North America was the second-largest region in the organic substrate packaging material market. The regions covered in the organic substrate packaging material market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
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Major Driver Impacting Market Growth
The increasing adoption of self-driving vehicles is expected to propel the organic substrate packaging material market growth going forward. The self-driving vehicles also known as autonomous car refers to a vehicle that is capable of sensing their surroundings and operating without human interaction. The self-driving vehicles require semiconductors for processing and sensing the captured data. The increasing use of semiconductors will increase the demand for the packaging of the semiconductors, which eventually will increase the demand for organic substrate packaging materials. For instance, in 2021, according to a report published by the SMMT, the trade association for the United Kingdom motor industry, connected and autonomous vehicles (CAVs), will boost the UK economy to £62 billion by 2030 and, there will 1 in every 5 miles will be traveled by self-driving vehicles while preventing 47,000+ accidents. Further, according to American Automobile Association, a US-based privately held not-for-profit national member association and service organization, 72% of U.S. adults feel safer in a self-driving car if they can take over the car. Therefore, the increasing adoption of self-driving vehicles is driving the growth of the organic substrate packaging material market.
Key Industry Players
Major companies operating in the organic substrate packaging material market report are Amkor Technology Inc., Advanced Semiconductor Engineering Inc., Compass Technology Co. Ltd., Hitachi Chemical Company Ltd., Mitsubishi Corporation, STATS ChipPAC Pte Ltd., NGK Spark Plug Co. Ltd., Shinko Electric Industries Co. Ltd., Showa Denko KK, Kyocera Corporation, WUS Printed Circuit Co. Ltd., Ajinomoto Group, Microchip Technology Inc., Texas Instruments Incorporated, Unimicron Technology Corporation, Ibiden Co. Ltd., AT&S Austria Technologie & Systemtechnik AG, Samsung Electro-Mechanics Co. Ltd., Amcor plc, Fujikura Ltd., Nippon Mektron Ltd., Tripod Technology Corporation, Compeq Manufacturing Co. Ltd., HannStar Board Corporation, Kingboard Chemical Holdings Ltd., Sumitomo Bakelite Co. Ltd., Panasonic Corporation, Nitto Denko Corporation, Rogers Corporation, Shenzhen Kinwong Electronic Co. Ltd., Unitech Printed Circuit Board Corporation, Young Poong Electronics Co. Ltd., CMK Corporation, Daeduck GDS Co. Ltd., Dynamic Electronics Co. Ltd., Flexium Interconnect Inc., Fujitsu Interconnect Technologies Ltd., Interflex Co. Ltd., LG Innotek Co. Ltd., Multek Corporation
The organic substrate packaging material market report table of contents includes:
1. Executive Summary
2. Organic Substrate Packaging Material Market Characteristics
3. Organic Substrate Packaging Material Market Trends And Strategies
4. Organic Substrate Packaging Material Market – Macro Economic Scenario
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31. Global Organic Substrate Packaging Material Market Competitive Benchmarking
32. Global Organic Substrate Packaging Material Market Competitive Dashboard
33. Key Mergers And Acquisitions In The Organic Substrate Packaging Material Market
34. Organic Substrate Packaging Material Market Future Outlook and Potential Analysis
