Market Size –
The outsourced semiconductor assembly and testing market size has grown rapidly in recent years. It will grow from $39.51 billion in 2023 to $43.56 billion in 2024 at a compound annual growth rate (CAGR) of 10.2%. The growth in the historic period can be attributed to integrated circuits demand, semiconductor miniaturization, cost efficiency, consumer electronics growth, regulatory compliance.
The outsourced semiconductor assembly and testing market size is expected to see strong growth in the next few years. It will grow to $63.46 billion in 2028 at a compound annual growth rate (CAGR) of 9.9%. The growth in the forecast period can be attributed to automotive industry, cybersecurity, global supply chain, outsourced manufacturing, environmental regulations. Major trends in the forecast period include 3d ic technology, 5g technology, artificial intelligence (ai) and machine learning, high-performance computing, advanced packaging.
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Scope Of Outsourced Semiconductor Assembly And Testing Market
The Business Research Company’s reports encompass a wide range of information, including:
1. Market Size (Historic and Forecast): Analysis of the market’s historical performance and projections for future growth.
2. Drivers: Examination of the key factors propelling market growth.
3. Trends: Identification of emerging trends and patterns shaping the market landscape.
4. Key Segments: Breakdown of the market into its primary segments and their respective performance.
5. Focus Regions and Geographies: Insight into the most critical regions and geographical areas influencing the market.
6. Macro Economic Factors: Assessment of broader economic elements impacting the market.
Outsourced Semiconductor Assembly And Testing Market Overview
Market Drivers –
The growing demand for consumer electronics is expected to propel the growth of the outsourced semiconductor assembly and testing market. The demand for consumer electronics is growing due to high disposable income, changing lifestyle of customers, growing middle-class population, and falling electronics prices. Outsourced semiconductor assembly and testing is an essential process to pass through before the use of these consumer electronics as well as it is a low-cost and innovative solution that enables electronic devices to increase performance, processing speeds, and usefulness while occupying less space. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, the total electronic equipment production in Japan accounted for $6,722 million (¥771,457 million). In addition, consumer electronics production reached $280 million (¥ 32,099 million) in May 2023, compared to $230.9 million (¥25,268 million) in May 2022. , Thus, a rise in demand for consumer electronics will drive the outsourced semiconductor assembly and testing market..
The outsourced semiconductor assembly and testing market covered in this report is segmented –
1) By Type: Test Service, Assembly Service
2) By Process: Sawing, Sorting, Testing, Assembly
3) By Packaging Type: Ball Grid Array, Chip Scale Package, Multi Package, Stacked Die, Quad And Dual
4) By Application: Communication, Consumer Electronics, Computing And Networking, Automotive, Industrial, Other Applications
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Regional Insights –
Asia-Pacific was the largest region in the outsourced semiconductor assembly and testing market in 2023. The regions covered in the outsourced semiconductor assembly and testing market report include Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.
Key Companies –
Major companies operating in the outsourced semiconductor assembly and testing market include Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Jiangsu Changjiang Electronics Tech Co. Ltd., King Yuan Electronics Co. Ltd., Alphacore Inc., Device Engineering Inc., HMT microelectronic AG, Luminar Technologies Inc., Presto Engineering Group, Sencio BV, ShortLink AB, SiFive Inc., Powertech Technology Inc., Tianshui Huatian Technology Co. Ltd., Nantong Fujitsu Microelectronics Co. Ltd., UTAC Holdings Ltd., Chipbond Technology Corporation, ChipMOS Technologies Inc., Huatian Technology Sdn. Bhd., Walton Advanced Engineering Inc., Signetics Corporation, Hana Micron Inc., NEPES Corporation, Sunrise Memory Corp., Tongfu Microelectronics Co. Ltd., Integrated Micro-electronics Inc., Formosa Advanced Technologies Co Ltd., Lingsen Precision Industries Ltd., Shenzhen CPET Electronics Co. Ltd., Bharat Electronics Limited
Table of Contents
1. Executive Summary
2. Outsourced Semiconductor Assembly And Testing Market Report Structure
3. Outsourced Semiconductor Assembly And Testing Market Trends And Strategies
4. Outsourced Semiconductor Assembly And Testing Market – Macro Economic Scenario
5. Outsourced Semiconductor Assembly And Testing Market Size And Growth
…..
27. Outsourced Semiconductor Assembly And Testing Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix
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