Outsourced Semiconductor Assembly And Testing Market 2024 – Industry Size, Business Segments, Innovative Strategies And Outlook by 2033

Overview and Scope
The outsourced semiconductor assembly and testing refer to a third-party service comprising semiconductor assembly, packaging, and testing of ICs (integrated circuits). The outsourced semiconductor assembly and testing (OSAT) services are offered by vendors/suppliers that are contracted by semiconductor design companies.

Sizing and Forecast
The outsourced semiconductor assembly and testing market size has grown rapidly in recent years. It will grow from $39.51  billion in 2023 to $43.56  billion in 2024 at a compound annual growth rate (CAGR) of 10.2%.  The  growth in the historic period can be attributed to integrated circuits demand, semiconductor miniaturization, cost efficiency, consumer electronics growth, regulatory compliance.

The outsourced semiconductor assembly and testing market size is expected to see strong growth in the next few years. It will grow to $63.46  billion in 2028 at a compound annual growth rate (CAGR) of 9.9%.  The growth in the forecast period can be attributed to automotive industry, cybersecurity, global supply chain, outsourced manufacturing, environmental regulations. Major trends in the forecast period include 3d ic technology, 5g technology, artificial intelligence (ai) and machine learning, high-performance computing, advanced packaging.

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Segmentation & Regional Insights

The outsourced semiconductor assembly and testing market covered in this report is segmented –

1) By Type: Test Service, Assembly Service

2) By Process: Sawing, Sorting, Testing, Assembly

3) By Packaging Type: Ball Grid Array, Chip Scale Package, Multi Package, Stacked Die, Quad And Dual

4) By Application: Communication, Consumer Electronics, Computing And Networking, Automotive, Industrial, Other Applications

Top Major Players
Advanced Semiconductor Engineering Inc
Amkor Technology Inc.
Jiangsu Changjiang Electronics Tech Co. Ltd.
King Yuan Electronics Co. Ltd.
Alphacore Inc.

Asia-Pacific was the largest region in the outsourced semiconductor assembly and testing market in 2023. The regions covered in the outsourced semiconductor assembly and testing market report include Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.

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Major Driver Impacting Market Growth
The growing demand for consumer electronics is expected to propel the growth of the outsourced semiconductor assembly and testing market. The demand for consumer electronics is growing due to high disposable income, changing lifestyle of customers, growing middle-class population, and falling electronics prices. Outsourced semiconductor assembly and testing is an essential process to pass through before the use of these consumer electronics as well as it is a low-cost and innovative solution that enables electronic devices to increase performance, processing speeds, and usefulness while occupying less space. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, the total electronic equipment production in Japan accounted for $6,722 million (¥771,457 million). In addition, consumer electronics production reached $280 million (¥ 32,099 million) in May 2023, compared to $230.9 million (¥25,268 million) in May 2022. ,  Thus, a rise in demand for consumer electronics will drive the outsourced semiconductor assembly and testing market..

Key Industry Players
Major companies operating in the outsourced semiconductor assembly and testing market include  Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Jiangsu Changjiang Electronics Tech Co. Ltd., King Yuan Electronics Co. Ltd., Alphacore Inc., Device Engineering Inc., HMT microelectronic AG, Luminar Technologies Inc.,  Presto Engineering Group, Sencio BV, ShortLink AB, SiFive Inc., Powertech Technology Inc., Tianshui Huatian Technology Co. Ltd., Nantong Fujitsu Microelectronics Co. Ltd., UTAC Holdings Ltd., Chipbond Technology Corporation, ChipMOS Technologies Inc., Huatian Technology Sdn. Bhd., Walton Advanced Engineering Inc., Signetics Corporation, Hana Micron Inc., NEPES Corporation, Sunrise Memory Corp., Tongfu Microelectronics Co. Ltd., Integrated Micro-electronics Inc., Formosa Advanced Technologies Co Ltd., Lingsen Precision Industries Ltd., Shenzhen CPET Electronics Co. Ltd., Bharat Electronics Limited

The outsourced semiconductor assembly and testing  market report table of contents includes:
1. Executive Summary
2. Outsourced Semiconductor Assembly And Testing Market Characteristics
3. Outsourced Semiconductor Assembly And Testing Market Trends And Strategies
4. Outsourced Semiconductor Assembly And Testing Market – Macro Economic Scenario
5. Global Outsourced Semiconductor Assembly And Testing Market Size and Growth
…………………………..
31. Global Outsourced Semiconductor Assembly And Testing Market Competitive Benchmarking
32. Global Outsourced Semiconductor Assembly And Testing Market Competitive Dashboard
33. Key Mergers And Acquisitions In The Outsourced Semiconductor Assembly And Testing Market
34. Outsourced Semiconductor Assembly And Testing Market Future Outlook and Potential Analysis
35. Appendix

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