How large is the polyamide hot melt adhesives market, and what is its growth trajectory?
The polyamide hot melt adhesives market size has grown strongly in recent years. It will grow from $0.63 billion in 2024 to $0.67 billion in 2025 at a compound annual growth rate (CAGR) of 6.4%. The growth in the historic period can be attributed to increased chemical endurance, growth in automotive industry, growth in footwear manufacturing, rise in global manufacturing, growth in sustainable packaging.
The polyamide hot melt adhesives market size is expected to see strong growth in the next few years. It will grow to $0.84 billion in 2029 at a compound annual growth rate (CAGR) of 6.1%. The growth in the forecast period can be attributed to growth of the packaging industry, increased focus on lightweight aerospace materials, increased demand for electric vehicles, growing demand in electronics. Major trends in the forecast period include advancements in manufacturing technologies, advancements in 5G and electronics, advances in packaging, advancements, integration with circular economy initiatives, application-specialized innovation.
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What are the key forces behind the polyamide hot melt adhesives market’s growth in recent years?
The increasing demand for consumer electronics is expected to propel the growth of the polyamide hot melt adhesives market going forward. Consumer electronics refer to electronic devices intended for everyday use by individuals. Consumer electronics use showcases an advancement towards new technology, increasing internet penetration, the proliferation of smart devices, and enhanced connectivity that cater to diverse consumer needs and preferences. Polyamide hot melt adhesives provide high thermal stability, excellent electrical insulation, and solid and durable bonds that withstand mechanical stress and temperature fluctuations, ensuring reliable and long-lasting component assemblies. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, the total electronic equipment production in Japan reached 771,457 units. In addition, consumer electronics production reached 32,099 units in May 2023, compared to 25,268 units in May 2022. Therefore, the increasing demand for consumer electronics is driving the growth of the polyamide hot melt adhesives market.
What are the major segments of the polyamide hot melt adhesives market?
The polyamide hot melt adhesivesmarket covered in this report is segmented –
1) By Type: Granules, Powder, Other Types
2) By Form: Thermosetting, Thermoplastic
3) By Application: Shoes And Textile, Automotive, Electrical, Woodworking, Other Applications
Subsegments:
1) By Granules: Low Viscosity Granules, High Viscosity Granules, Recycled Granules
2) By Powder: Fine Powder, Coarse Powder, Specialty Powder
3) By Other Types: Liquid Adhesives, Films And Sheets, Emulsions
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Which companies dominate the polyamide hot melt adhesives market?
Major companies operating in the polyamide hot melt adhesives market are BASF SE, 3M Company, Henkel AG And Co. KGaA, Evonik Industries, Dow Chemical Company, Sika AG, Arkema S.A., Huntsman Corporation, H.B. Fuller Company, Bostik Inc., DuPont, TEX YEAR INDUSTRIES INC., Beardow Adams Ltd., Shanghai Tianyang Hot Melt Adhesive Co. Ltd., Jowat SE, Bühnen GmbH & Co. KG, Palmetto Adhesives Company, Schaetti, Sipol, Huate Bonding Material, Shanghai Tianyang, Bond Tech Industries
What major trends will shape the polyamide hot melt adhesives market during the forecast period?
Major companies operating in the polyamide hot melt adhesives market are developing hot melt label adhesive solutions to improve durability, performance, and versatility for a wide range of labeling applications. A hot melt label adhesive solution is an adhesive used for applying labels activated by heat. For instance, in April 2023, Avery Dennison and Dow, a US-based company operating in materials science and digital identification solutions, launched a groundbreaking hot melt label adhesive aimed at enhancing the recyclability of packaging. This innovative adhesive allows for the mechanical recycling of polyolefin filmic labels and polypropylene (PP) or polyethylene (PE) packaging in a single stream, effectively treating them as a mono-material. It is the first olefinic hotmelt adhesive designed explicitly for chilled food applications on the label market. The adhesive has received approval from Recyclass for recycling in the high density polyethylene (HDPE) colored stream in European markets.
What are the key regional dynamics of the polyamide hot melt adhesives market, and which region leads in market share?
Asia-Pacific was the largest region in the polyamide hot melt adhesives market in 2024, and is expected to be the fastest-growing region in the forecast period. The regions covered in the polyamide hot melt adhesives market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
What Does The Polyamide Hot Melt Adhesives Market Report 2025 Offer?
The polyamide hot melt adhesives market research report from The Business Research Company offers global market size, growth rate, regional shares, competitor analysis, detailed segments, trends, and opportunities.
Polyamide hot melt adhesives are a type of thermoplastic adhesive made from polyamide resins, which are synthesized from dimer acids and diamines. These adhesives are known for their excellent bonding strength, flexibility, and heat resistance, making them ideal for various industrial applications. The ability to handle high temperatures and resist moisture and chemicals makes them highly valuable.
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