Radiation-Hardened Electronics Global Market By Component, By Product Type, By Application, By Technology, By Region and Segment Forecast, 2024-2033 | BAE Systems Inc., Micropac Industries Inc., GSI Technology Inc., Mercury Systems Inc., Atmel Corporation

Overview and Scope
Radiation-hardened electronics or rad-hard electronics are single-board computer central processing units (CPUs), and sensors that have been designed and produced to be less prone to damage from exposure to radiation and exceptionally elevated temperatures. It is a process of making a component or a system resistant to the damages that can be caused by cosmic rays, ionizing and other electromagnetic radiations.

Sizing and Forecast
The radiation-hardened electronics market size has grown steadily in recent years. It will grow from $1.68 billion in 2023 to $1.76 billion in 2024 at a compound annual growth rate (CAGR) of 4.3%. The growth in the historic period can be attributed to military and defense applications, nuclear industry requirements, high-altitude aerospace mission, medical and healthcare equipment, security and critical infrastructure.

The radiation-hardened electronics market size is expected to see steady growth in the next few years. It will grow to $2.09 billion in 2028 at a compound annual growth rate (CAGR) of 4.4%. The growth in the forecast period can be attributed to rise of autonomous vehicles, miniaturization and compact electronics demand, iot and connected devices in extreme environments, security and critical infrastructure growth, expansion in medical devices. Major trends in the forecast period include space exploration and satellite technology, technological advancements, high-altitude aerospace applications, medical and healthcare equipment..

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Segmentation & Regional Insights
The radiation-hardened electronics market covered in this report is segmented –
1) By Product Type: Commercial-Off-The-Shelf (COTS), Custom Made
2) By Component: Power Management, Application Specific Integrated Circuit, Logic, Memory, Field-Programmable Gate Array, Other Components
3) By Manufacturing Technique: Rad-Hard By Process, Rad-Hard By Design, Rad-Hard By Software
4) By Application: Space Satellites, Commercial Satellites, Military, Aerospace and Defense, Nuclear Power Plants, Other Applications

North America was the largest region in the radiation hardened electronics market in 2023. The regions covered in the radiation-hardened electronics market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

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Major Driver Impacting Market Growth
The increasing number of satellites is expected to propel the growth of the radiation-hardened electronics market going forward. A satellite is a tool that is launched into space to orbit the Earth and collect data. Rad-hard electronics can withstand extreme radiation and temperatures better than commercial-grade chips, which makes them suitable for space environments and are preferred to be used in satellites by space agencies, private spaceflight companies, and others. For instance, according to United Nations Office for Outer Space Affairs (UNOOSA) records, 8,261 satellites are orbiting the Earth now, of which only 4,852 satellites are active. Therefore, the increasing number of satellites is driving the growth of the radiation-hardened electronics market.

Key Industry Players
Major companies operating in the radiation-hardened electronics market report are Microchip Technology Inc., BAE Systems Inc., Renesas Electronics Corporation, Infineon Technologies AG, STMicroelectronics, Xilinx Inc., Texas Instruments Incorporated, Honeywell International Inc., Analog Devices Inc., Micropac Industries Inc., GSI Technology Inc., Mercury Systems Inc., Teledyne Technologies, Vorago Technologies, Maxwell Technologies, TTM Technologies Inc., International Business Machines Corporation, Data Device Corporation, Atmel Corporation, Intersil Corporation, Linear Technology Corporation, National Semiconductor Corporation, On Semiconductor Corporation, Silicon Laboratories Inc., Microsemi Corporation, X-Celeprint Limited, ABLIC Inc., Aeroflex Inc., Analogic Corporation, Crane Aerospace & Electronics

The radiation-hardened electronics market report table of contents includes:
1. Executive Summary