Semiconductor Assembly And Packaging Equipment Market Report 2024-2033: Size, Trends, Analysis, Insights, and Overview

Overview and Scope

Semiconductor assembly and packaging equipment refer to a device used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit.

Sizing and Forecast

The semiconductor assembly and packaging equipment market size has grown rapidly in recent years. It will grow from $11.23 billion in 2023 to $12.45 billion in 2024 at a compound annual growth rate (CAGR) of 10.9%. The growth in the historic period can be attributed to growth in emerging markets, an increasing demand for semiconductor equipment, an increasing demand for consumer electronics and a rise in disposable income.

The semiconductor assembly and packaging equipment market size is expected to see strong growth in the next few years. It will grow to $17.95 billion in 2028 at a compound annual growth rate (CAGR) of 9.6%. The growth in the forecast period can be attributed to government initiatives to propel the semiconductor industry, an increasing demand for electric vehicles, an increasing demand from the medical industry, rising urbanization and an increasing demand for portable electronic devices. Major trends in the forecast period include focus on the launch of new semiconductor inspection machines using big data and ai (artificial intelligence), focus on innovating new products such as the introduction of a new automatic flip-chip bonder, focus on introducing compound semiconductor equipment to strengthen the wet process product line, focus on increasing investment and focus on undergoing partnerships to develop new products.

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Segmentation & Regional Insights

The semiconductor assembly and packaging equipment market covered in this report is segmented –

1) By Type: Plating Equipment, Inspection And Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment, And Other Types.
2) By Application: Companion Animals, Livestock.
3) By End User: OSATS (Outsourced Semiconductor Assembly And Test), IDMS (Integrated Device Manufacturers).

Asia-Pacific was the largest region in the semiconductor assembly and packaging equipment market in 2023. Western Europe was the second-largest region in the global semiconductor assembly and packaging equipment market share. The regions covered in the semiconductor assembly and packaging equipment market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa

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Major Driver Impacting Market Growth

Rising demand for consumer electronics is anticipated to contribute to the growth of the semiconductor assembly and packaging equipment market. Consumer electronics is a key segment that is entirely dependent on the semiconductor industry. According to the India Brand Equity Foundation, the Indian appliance and consumer electronics market stood at $10.93 billion in 2019 and is expected to increase at a CAGR of 9% to reach $48.37 billion by 2022. In recent years, the applications of semiconductor Integrated Circuits (ICs) in various electronic devices are continuously increasing to perform multiple functions. Therefore, growing consumer electronics is likely to intensify the demand for growth of semiconductor assembly and packaging equipment market.

Key Industry Players

Major companies operating in the semiconductor assembly and packaging equipment market report are Tokyo Electron Ltd, Applied Materials, Inc, Kulicke and Soffa Industries, Inc, ASML Holding N.V, BE Semiconductor Industries N.V, Tokyo Seimitsu, Amkor Technology, ASM Pacific Technology, Screen Holdings Co. Ltd, KLA-Tencor, Toshiba Corp, Cypress Semiconductor Corp, ARM LTD, Renesas Electronics Corporation, Fujitsu Limited, Panasonic Corporation, Continental Device India Ltd (CDIL), MosChip Semiconductor Technologies, Advanced Semiconductor Engineering Inc, Zhixin Semiconductor, UNISOC, Yangtze Memory Technologies Co., Ltd (YTMC), GigaDevice, CR Micro, Silan, Infineon Technologies AG, UnitySC, Dialog Semiconductor Plc, Lam Research Corporation, Hitachi High Technologies Corporation, Advantest, Teradyne Inc, Smart Modular Technologies, Tecsys, Multilaser, Flextronics, Digitron, STMicroelectronics, ROHM Semiconductor, Semiconductors and Technologies Limited Company, Fei – Randburg, Electronic components CSE, Kh Distributors, Avnet Kopp, Renewable Energy Semiconductor Manufacturing company, SGS Ghana Limited.

The semiconductor assembly and packaging equipment market report table of contents includes:

1. Executive Summary

2. Semiconductor Assembly And Packaging Equipment Market Characteristics

3. Semiconductor Assembly And Packaging Equipment Market Trends And Strategies

4. Semiconductor Assembly And Packaging Equipment Market – Macro Economic Scenario

5. Global Semiconductor Assembly And Packaging Equipment Market Size and Growth

…

32. Global Semiconductor Assembly And Packaging Equipment Market Competitive Benchmarking

33. Global Semiconductor Assembly And Packaging Equipment Market Competitive Dashboard

34. Key Mergers And Acquisitions In The Semiconductor Assembly And Packaging Equipment Market

35. Semiconductor Assembly And Packaging Equipment Market Future Outlook and Potential Analysis

36. Appendix

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