What are the latest figures on the semiconductor plating system market’s size and projected CAGR?
The semiconductor plating system market size has grown strongly in recent years. It will grow from $5.51 $ billion in 2024 to $5.86 $ billion in 2025 at a compound annual growth rate (CAGR) of 6.4%. The growth in the historic period can be attributed to the rise in electric vehicles, growth in semiconductor industry capital expenditure, growth in cloud computing services, growth in telecommunications infrastructure, and rise in renewable energy.
The semiconductor plating system market size is expected to see strong growth in the next few years. It will grow to $7.41 $ billion in 2029 at a compound annual growth rate (CAGR) of 6.0%. The growth in the forecast period can be attributed to rising production of electric vehicles, growing expansion of data centers, growing demand for enhanced semiconductor devices, increasing focus on sustainable and green semiconductor manufacturing, and increasing demand for semiconductors. Major trends in the forecast period include technological advancements, the adoption of advanced packaging technologies, 5G-enabled devices, Internet of Things devices, and wearable technology.
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Which Market drivers have played a significant role in driving the semiconductor plating system market?
The growing adoption of electric vehicles is expected to propel the growth of the semiconductor plating system market going forward. Electric vehicles refer to automobiles powered either entirely or partially by electricity stored in rechargeable batteries rather than by internal combustion engines. The adoption of electric vehicles is due to rising environmental awareness, government incentives, advancements in battery technology, and increasing consumer demand for sustainable transportation solutions. Semiconductor plating systems are used in electric vehicles to enhance power management, battery control, and electronic systems by applying precise metal coatings to semiconductor components, improving their conductivity, reliability, and performance. For instance, in March 2023, according to the International Energy Agency, a France-based intergovernmental organization, the electric car market experienced exponential growth in 2022, with sales surpassing 10 million units and electric vehicles comprising 14% of all new car sales, up from approximately 9% in 2021. Therefore, the growing adoption of electric vehicles is driving the growth of the semiconductor plating system market.
What are the key segments within the semiconductor plating system market?
The semiconductor plating systemmarket covered in this report is segmented –
1) By Type: Fully Automatic, Semi-Automatic, Manual
2) By Wafer Size: Up To 100 mm, 100 mm To 200 mm, Above 200 mm
3) By Technology: Electroplating, Electroless
4) By Applications: Through Silicon Via (TSV), Copper Pillar, Redistribution Layer (RDL), Under Bump Metallization (UBM), Bumping, Other Applications
Subsegments:
1) Fully Automatic: Batch Processing Systems, Inline Processing Systems, Automated Control Systems
2) Semi-Automatic: Manual Override Systems, Semi-Automatic Batch Systems, User-Controlled Systems
3) Manual: Manual Plating Systems, Handheld Plating Tools, Manual Control Systems
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Which key players are shaping the semiconductor plating system market?
Major companies operating in the semiconductor plating system market are Applied Materials Inc., Solvay SA, Tokyo Electron Limited, Lam Research Corporation, Hitachi High-Tech Corporation, JBT Corporation, ACM Research Inc., Hitachi Kokusai Electric Inc., Atotech, JCU International Inc., Ishihara Chemical Co. Ltd., RENA Technologies GmbH, Singulus Technologies AG, Intevac Inc., Akrion Technologies Inc., Semsysco GmbH, Magneto Special Anodes GmbH, Raschig GmbH, Moses Lake Industries Inc., Yamato Denki Co. Ltd., Mitomo Semicon Engineering Co. Ltd., XiLong Scientific Co. Ltd., Meltex Inc.
Which transformative trends will shape the semiconductor plating system market landscape?
Major companies operating in the semiconductor plating system market are focused on developing innovative technologies, such as dripless technology, to enhance the selective plating process by making it more environmentally friendly. Dripless technology is a plating process innovation that eliminates chemical drips and reduces waste by efficiently recycling solutions throughout the system. For instance, in June 2022, SIFCO ASC., a US-based provider of contract anodizing and selective electroplating services, launched the Advanced Solution Control System, a unique, portable plating equipment to improve the selective electroplating process. It incorporates dripless technology, effectively maintaining and recycling chemical solutions and reducing waste and exposure. The ASCS provides improved automation, which improves operating efficiency and safety by minimizing the need for manual intervention and lessening the risk of chemical spills and emissions. This system is available in two models, Nano and Prime, each with distinct complexity levels and plating needs, making it a viable solution for various industrial applications.
How do regional factors impact the semiconductor plating system market, and which region is the largest contributor?
Asia-Pacific was the largest region in the semiconductor plating system market in 2024. North America is expected to be the fastest-growing region in the forecast period. The regions covered in the semiconductor plating system market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
What Does The Semiconductor Plating System Market Report 2025 Offer?
The semiconductor plating system market research report from The Business Research Company offers global market size, growth rate, regional shares, competitor analysis, detailed segments, trends, and opportunities.
A semiconductor plating system refers to a technology used in the manufacturing process of semiconductors, where thin layers of metal or other materials are deposited onto semiconductor wafers. They are used for creating electrical connections, enhancing the performance and reliability of semiconductor devices, and ensuring the proper functioning of integrated circuits and electronic components.
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