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What are the recent trends in market size and growth for the thick film hybrid integrated circuits market?
The thick film hybrid integrated circuits market size has grown strongly in recent years. It will grow from $3.68 billion in 2024 to $3.93 billion in 2025 at a compound annual growth rate (CAGR) of 6.8%. The growth in the historic period can be attributed to growing electronics, rising demand for miniaturization, increasing adoption in the automotive industry, growth in the telecommunications sector, expanding medical device applications, government regulations and standards, and high initial investment costs.
The thick film hybrid integrated circuits market size is expected to see strong growth in the next few years. It will grow to $5.06 billion in 2029 at a compound annual growth rate (CAGR) of 6.5%. The growth in the forecast period can be attributed to the growth of IoT devices, advancements in 5G technology, increasing demand for wearable devices, rising investments in smart infrastructure, the expansion of the renewable energy sector, increasing need for efficient power management, and the and the growing automotive electronics. Major trends in the forecast period include miniaturization and integration of electronics, rapid prototyping and customization, the emergence of advanced materials, and integration with emerging technologies.
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How have varous drivers impacted the growth of the thick film hybrid integrated circuits market?
The growing demand for consumer electronics is expected to propel the growth of the thick-film hybrid integrated circuits market going forward. Consumer electronics encompasses devices designed for personal and daily use, including smartphones, tablets, laptops, and home entertainment systems. Technological progress, expanding connectivity, and the need for convenience and entertainment in everyday activities propel the rising demand for consumer electronics. Thick-film hybrid integrated circuits are used in consumer electronics to combine the advantages of thick-film and integrated circuit technologies, offering compactness, reliability, and cost-effectiveness. For instance, in February 2024, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade organization, consumer electronic equipment production reached $201.91 million (¥31,685 million), up from $149.27 million (¥ 23,425 million) in January 2023. Therefore, growing demand for consumer electronics will drive the growth of the thick-film hybrid integrated circuits market.
What are the primary segments of the thick film hybrid integrated circuits market?
The thick film hybrid integrated circuits market covered in this report is segmented –
1) By Type: 96% Al2O3 Ceramic Substrate, Beryllium Oxide (BeO) Ceramic Substrate, Aluminum Nitride (AIN) Based, Other Substrates
2) By Product Type: Active, Passive, Electromechanical Components
3) By Application: Avionics And Defense, Automotive, Telecoms And Computer Industry, Consumer Electronics, Other Applications
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Which firms are leading the thick film hybrid integrated circuits market?
Major companies operating in the thick film hybrid integrated circuits market are Panasonic Corporation, GE Aerospace, Infineon Technologies AG, ROHM CO. Ltd., Vishay Intertechnology, KEMET Corporation, Fenghua Advanced Technology Holding CO.Ltd., Semtech Corporation, TT Electronics, Anritsu Corporation, Beijing Sevenstar Electronics Co. Ltd., KYOCERA AVX, Ohmite Manufacturing Company, Electro Technik Industries Inc., Delphi Technologies, Zhejiang Huzhou Xinjingchang Electronics Co. Ltd., Corintech Ltd., VPT Inc., AUREL s.p.a., Custom Interconnect Limited, Japan Resistor Mfg. Co. Ltd., Micro Hybrid Electronic GmbH, Advance Circuit Technology Inc., Cermetek Microelectronics, Hybrionic Pte, Bergh Hybrid Circuits, Integrated Technology Lab, Midas Microelectronics, Weiking Electronics Manufacturing, Globec Limited
How will industry trends affect the trajectory of the thick film hybrid integrated circuits market?
Major companies operating in the thick-film hybrid integrated circuits market are focused on developing innovative hybrid bonding reference flow to enhance performance, improve thermal management, and reduce interconnect resistance, ultimately enabling higher-density, high-reliability solutions for applications in sectors such as automotive, aerospace, telecommunications, and medical devices. Hybrid bonding reference flow refers to a standardized or recommended process used in semiconductor manufacturing, specifically in advanced packaging and 3D integration. For instance, in February 2023, United Microelectronics Corporation (UMC), a Taiwan-based semiconductor corporation and Cadence Design Systems, an India-based software company have collaborated to develop a 3D-IC Hybrid Bonding Reference Flow, which is designed to enhance the efficiency and effectiveness of 3D integrated circuit (IC) design. This collaboration aims to streamline the design process for advanced semiconductor applications, particularly in areas such as edge AI, image processing, and wireless communication.
Which geographic trends are shaping the thick film hybrid integrated circuits market, and which region has the highest market share?
North America was the largest region in the thick film hybrid integrated circuits market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the thick film hybrid integrated circuits market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
What Does The Thick Film Hybrid Integrated Circuits Market Report 2025 Offer?
The thick film hybrid integrated circuits market research report from The Business Research Company offers global market size, growth rate, regional shares, competitor analysis, detailed segments, trends, and opportunities.
Thick-film hybrid integrated circuits (HICs) are electronic circuits that combine various electrical components. The term ‘thick-film’ refers to the method used to deposit the conductive, resistive, and insulating materials onto the substrate, which involves screen printing and firing layers of paste materials to create the desired circuit patterns. The primary purpose of thick-film hybrid integrated circuits is to create compact, reliable, high-performance electronic circuits operating in demanding environments.
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