The thin wafer global market report 2024 from The Business Research Company provides comprehensive market statistics, including global market size, regional shares, competitor market share, detailed segments, trends, and opportunities. This report offers an in-depth analysis of current and future industry scenarios, delivering a complete perspective for thriving in the industrial automation software market.
Thin Wafer Market, 2024 report by The Business Research Company offers comprehensive insights into the current state of the market and highlights future growth opportunities.
Market Size –
The thin wafer market size has grown rapidly in recent years. It will grow from $10.73 billion in 2023 to $11.85 billion in 2024 at a compound annual growth rate (CAGR) of 10.4%. The growth in the historic period can be attributed to increased demand for miniaturized devices, rising adoption in semiconductor industry, cost reduction, growing consumer electronics market, growing demand for photovoltaic cells.
The thin wafer market size is expected to see strong growth in the next few years. It will grow to $17.33 billion in 2028 at a compound annual growth rate (CAGR) of 10.0%. The growth in the forecast period can be attributed to increasing use in automotive electronics, growing focus on renewable energy, focus on energy efficiency, demand for compact and lightweight devices. Major trends in the forecast period include rise in iot and connected devices, advancements in semiconductor packaging, expansion of 5g technology, wafer-level chip scale packaging (wlcsp), technological innovations in wafer thinning.
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Scope Of Thin Wafer Market
The Business Research Company’s reports encompass a wide range of information, including:
1. Market Size (Historic and Forecast): Analysis of the market’s historical performance and projections for future growth.
2. Drivers: Examination of the key factors propelling market growth.
3. Trends: Identification of emerging trends and patterns shaping the market landscape.
4. Key Segments: Breakdown of the market into its primary segments and their respective performance.
5. Focus Regions and Geographies: Insight into the most critical regions and geographical areas influencing the market.
6. Macro Economic Factors: Assessment of broader economic elements impacting the market.
Thin Wafer Market Overview
Market Drivers –
The growing smartphone and consumer electronics market is expected to propel the thin wafer market. Consumer electronics refers to an electronic device designed to be purchased and used by an end-user for daily, non-commercial or professional purposes. They are powered by electricity or have circuit boards. Thin wafers are used to fabricate integrated circuits and for high-density packaging in compact or microelectronic devices that power consumer electronics. So, an increase in the smartphone and consumer electronics market will propel market growth. For instance, in February 2023, according to Uswitch Limited, a UK-based financial conduct authority, beginning in 2022, there were 71.8 million mobile connections in the UK, a 3.8% (or around 2.6 million) increase over 2021. By 2025, there will be 68.3 million people living in the UK, of whom 95% (or about 65 million people) will have smartphones. Furthermore, in December 2022, according to a report shared by Shopify, a Canada-based multinational e-commerce company, the amount spent on consumer electronics had increased by 20% since 2020. The largest market for consumer electronics, smartphones, generated $481 billion in revenue in 2021. By 2026, it’s anticipated that this will surpass $500 billion. Therefore, the growing smartphone and consumer electronics market is driving the growth of the thin wafer market.
Market Trends –
Technological advancement is a key trend in the thin wafer market. Major companies operating in the thin wafer market are focused on developing new cleaning technology to strengthen their position in the market. For instance, in May 2022, Soitec, a France-based semiconductor company, launched a 200-mm SmartSiC-engineered substrate specifically tailored for automotive applications. The introduction of the 200mm SmartSiC wafer showcases improved power electronics device performance and heightened energy efficiency for electric vehicles, underscoring Soitec’s commitment to innovation and meeting industry demands.
The thin wafer market covered in this report is segmented –
1) By Wafer Size: 125 Mm, 200 Mm, 300 Mm
2) By Process: Temporary Bonding And Debonding, Carrier-Less Or Taiko Process
3) By Technology: Wafer Grinding, Wafer Polishing, Wafer Dicing
4) By Application: MEMS, CIS, RF Devices, LED, Interposer, Logic, Other Applications
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Regional Insights –
Asia-Pacific was the largest region in the thin wafer market analysis in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the thin wafer market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Key Companies –
Major companies operating in the thin wafer market report are 3M Company, Applied Materials Inc., Brewer Science Inc., DISCO Corporation, EV Group, GlobalWafers Co. Ltd., Shin-Estu Chemical Co. Ltd., Sil’tronix Silicon Technologies, SK Siltron Co. Ltd., SUMCO Corporation, SUSS MicroTec, Synova S A, Virginia Semiconductor Inc., ULVAC GmbH, Wafer Works Corporation, Atecom Technology Co. Ltd., UniversityWafer Inc., Mechatronic Systemtechnik GmbH, Soitec, My-Chip Production GmbH, Polishing Corporation of America, Kulicke & Soffa Industries Inc., SunEdison Semiconductor, LG Siltronic, Han’s Laser Technology Industry Group Co. Ltd., ASM Pacific Technology Ltd., Aixtron SE, SPTS Technologies Limited, Nuvonyx Inc., Semiconductor Equipment Corporation
Table of Contents
1. Executive Summary
2. Thin Wafer Market Report Structure
3. Thin Wafer Market Trends And Strategies
4. Thin Wafer Market – Macro Economic Scenario
5. Thin Wafer Market Size And Growth
…..
27. Thin Wafer Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix
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