The three dimensional (3d) integrated circuits (ic) global market report 2024 from The Business Research Company provides comprehensive market statistics, including global market size, regional shares, competitor market share, detailed segments, trends, and opportunities. This report offers an in-depth analysis of current and future industry scenarios, delivering a complete perspective for thriving in the industrial automation software market.
Three Dimensional (3D) Integrated Circuits (IC) Market, 2024 report by The Business Research Company offers comprehensive insights into the current state of the market and highlights future growth opportunities.
Market Size –
The three dimensional (3D) integrated circuit (IC) market size has grown rapidly in recent years. It will grow from $10.73 billion in 2023 to $12.41 billion in 2024 at a compound annual growth rate (CAGR) of 15.7%. The growth in the historic period can be attributed to increased demand for advanced electronic products, the rising need for improved energy efficiency, rising demand for higher-performance electronics.
The three dimensional (3D) integrated circuit (IC) market size is expected to see rapid growth in the next few years. It will grow to $22.33 billion in 2028 at a compound annual growth rate (CAGR) of 15.8%. The growth in the forecast period can be attributed to a spike in demand for smart devices and sophisticated integrations, an increase in investment in research and development activities, an increasing need for 3D ICs in sectors like servers and data hubs, and the military and aerospace sectors. Growing need for semiconductor industries, expansion of IoT and AI technologies. Major trends in the forecast period include the constant need for miniaturization of devices, the use of advanced packaging technologies, heterogeneous integration of devices, a focus on sustainability and energy efficiency, the customization of 3D IC solutions for specific applications, the development of new materials for better performance and efficiency, and enhanced manufacturing processes to reduce costs.
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Scope Of Three Dimensional (3D) Integrated Circuits (IC) Market
The Business Research Company’s reports encompass a wide range of information, including:
1. Market Size (Historic and Forecast): Analysis of the market’s historical performance and projections for future growth.
2. Drivers: Examination of the key factors propelling market growth.
3. Trends: Identification of emerging trends and patterns shaping the market landscape.
4. Key Segments: Breakdown of the market into its primary segments and their respective performance.
5. Focus Regions and Geographies: Insight into the most critical regions and geographical areas influencing the market.
6. Macro Economic Factors: Assessment of broader economic elements impacting the market.
Three Dimensional (3D) Integrated Circuits (IC) Market Overview
Market Drivers –
The growing semiconductor industry is expected to propel the growth of the three-dimensional (3D) integrated circuit (IC) market going forward. The semiconductor industry encompasses companies engaged in designing, manufacturing, and selling semiconductor devices, which are essential components in a wide range of electronic products such as computers, smartphones, and industrial machinery. The semiconductor industry is experiencing significant growth due to the proliferation of consumer electronics, such as smartphones, tablets, and wearable devices, which drives the demand for advanced semiconductor components. Moreover, the rollout of 5G networks requires new semiconductor technologies for improved communication, faster data transfer, and enhanced connectivity. 3D ICs offer several advantages for semiconductor applications, including enhanced performance, improved power efficiency, space optimization, and effective thermal management. For instance, in July 2024, according to the Semiconductor Industry Association (SIA), a US-based trade association and lobbying group that represents the United States semiconductor industry, global semiconductor industry sales hit $49.1 billion during May 2024, an increase of 19.3% compared to the May 2023 total of $41.2 billion and an increase of 4.1% compared to the April 2024 total of $47.2 billion. Therefore, the growing need for semiconductor industries drives the growth of the three-dimensional (3D) integrated circuit (IC) market.
Market Trends –
Major companies operating in the Three Dimensional (3D) Integrated Circuits (IC) market are focusing on developing custom 3D ICs tailored to specific applications or customer requirements such as 5G radio frequency performance, to gain competitive advantage, meet precise market needs, and drive higher revenue through specialized solutions. 3D IC technology enhances 5G by integrating multiple high-speed components into a single package, improving performance, reducing latency, and enabling more compact and efficient network infrastructure and devices. For instance, in May 2024, United Microelectronics Corporation, a Taiwan-based multinational corporation and semiconductor company, launched the industry’s first 3D IC solution for radio frequency silicon on insulator (RFSOI) technology, marking a significant advancement in the 5G era. This pioneering technology, available on UMC’s 55nm RFSOI platform, reduces circuit footprint by over 45%, allowing for integrating more RF components into 5G devices. The innovative 3D IC solution addresses the challenge of radio frequency (RF) interference and sets the stage for future developments in 5G millimeter-wave (mmWave) technology.
The three dimensional (3D) integrated circuits (IC) market covered in this report is segmented –
1) By Components: Through Glass Vias (TGVs), Through Silicon Vias (TSVs), Other Components
2) By Technology: 3D Stacked Integrated Circuit (ICs), Monolithic 3D Integrated Circuit (ICs), Integration And Packaging Type
3) By Application: Aerospace And Industrial, Telecommunication And Information Technology (IT), Automotive, Consumer Electronics, Medical, Industrial, Other Applications
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Regional Insights –
North America was the largest region in the three dimensional (3D) integrated circuit (IC) market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the three dimensional (3D) integrated circuits (IC) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
Key Companies –
Major companies operating in the three dimensional (3D) integrated circuits (IC) market are Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, International Business Machines Corporation, Qualcomm Incorporated, SK Hynix Inc., Broadcom Inc., Micron Technology Inc., NVIDIA Corporation, Toshiba Corporation, Advanced Micro Devices Inc. (AMD), ASML Holding N.V., Texas Instruments Incorporated, MediaTek Inc., STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, ON Semiconductor Corporation, GlobalFoundries Inc., Microchip Technology Incorporated, Marvell Technology Group Ltd., JCET Group, Xilinx Inc., Silicon Labs Inc., Rambus Inc.
Table of Contents
1. Executive Summary
2. Three Dimensional (3D) Integrated Circuits (IC) Market Report Structure
3. Three Dimensional (3D) Integrated Circuits (IC) Market Trends And Strategies
4. Three Dimensional (3D) Integrated Circuits (IC) Market – Macro Economic Scenario
5. Three Dimensional (3D) Integrated Circuits (IC) Market Size And Growth
…..
27. Three Dimensional (3D) Integrated Circuits (IC) Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix
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