Through-Hole Passive Components Global Market Size will Exceed $50.89 Billion with a Projected CAGR of 7.0% By 2028 | Fujitsu Ltd., Bourns Inc., YAGEO Corp, EPCOS AG, TDK Corporation

Overview and Scope
Through-hole passive component refers to a mounting method for electronic components that involves the use of leads on the components. It is inserted into holes drilled in PCBs and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mounting machines.

Sizing and Forecast
The through-hole passive components market size has grown strongly in recent years. It will grow from $36.26 billion in 2023 to $38.83 billion in 2024 at a compound annual growth rate (CAGR) of 7.1%.  The growth in the historic period can be attributed to electronics manufacturing boom, industrial automation and control systems, consumer electronics adoption, automotive electronics integration, telecommunication infrastructure development.

The through-hole passive components market size is expected to see strong growth in the next few years. It will grow to $50.89 billion in 2028 at a compound annual growth rate (CAGR) of 7.0%.  The growth in the forecast period can be attributed to renewable energy systems, smart grid technologies, Internet of things (IoT) expansion, electric vehicles (EVs) market growth, 5G network deployment. Major trends in the forecast period include expansion of application areas in automotive electronics, integration of through-hole components in IoT devices, emphasis on high-temperature and harsh environment components, introduction of low-profile through-hole inductors, increased automation in through-hole component manufacturing.

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Segmentation & Regional Insights
The through-hole passive component market covered in this report is segmented –
1) By Component: Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, Other Components
2) By Leads Model: Axial, Radial
3) By Application: Consumer Electronics, Automotive, Industrial, IT And Telecom, Aerospace And Defense, Healthcare and Life Sciences, Other Applications

Asia-Pacific was the largest region in the through-hole passive component market in 2023, is expected to be the fastest-growing region in the global through-hole passive component market report during the forecast period. The regions covered in the through-hole passive components market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

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Major Driver Impacting Market Growth
Rising demand for consumer electronic devices is expected to propel the growth of the through-hole passive component market going forward. A consumer electronic device is any gadget that contains an electronic circuit board and is intended for use by individuals on a daily basis. The rising adoption of smart home gadgets, wearables, and other connected devices drives up demand for electrical components, thus rising popularity of through-hole passive component. For instance, in January 2023, according to a statistical report published by the U.S. Census Bureau, a US-based agency of the U.S. Federal Statistical System, the monthly retail sales of electronics and appliances in the United States were $7.59 billion in May 2022. This shows an impressive $3.37 billion increase in retail sales of electronics and appliances over the two-year period. Therefore, the rising demand for consumer electronic devices will drive the through-hole passive component market.

Key Industry Players
Major companies operating in the through-hole passive components market report are Panasonic Holdings Corporation, Fujitsu Ltd., Texas Instruments Inc., TE Connectivity Ltd., TDK Corporation, Infineon Technologies AG, Murata Manufacturing Co Ltd., NXP Semiconductors NV, Microchip Technology Inc., Rohm Co Ltd., YAGEO Corp, Vishay Intertechnology Inc., Bourns Inc., Taiyo Yuden Co Ltd., Würth Elektronik Group, AVX Corporation, Nichicon Corporation, KEMET Corporation, Nippon Chemi-Con Corporation, KYOCERA AVX Components Corporation, Rubycon Corporation, Holy Stone Enterprise Co Ltd., EPCOS AG, Lelon Electronics Corp, Elna Co Ltd., Sagami Elec Co Ltd., Cornell Dubilier Electronics Inc., KOA Speer Electronics Inc., NIC Components Corporation, WIMA GmbH & Co KG

The through-hole passive components market report table of contents includes:
1. Executive Summary
2. Through-Hole Passive Components Market Report Structure
3. Through-Hole Passive Components Market Trends And Strategies
4. Through-Hole Passive Components Market – Macro Economic Scenario
5. Through-Hole Passive Components Market Size And Growth
…..
32. Global Through-Hole Passive Components Market Competitive Benchmarking
33. Global Through-Hole Passive Components Market Competitive Dashboard
34. Key Mergers And Acquisitions In The Through-Hole Passive Components Market
35. Through-Hole Passive Components Market Future Outlook and Potential Analysis
36. Appendix

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