3D IC And 2.5D IC Packaging Global Market Growth, Trends, Statistics 2032

The 3D IC And 2.5D IC Packaging Global Market Report 2023, provides comprehensive information on the 3d ic and 2.5d ic packaging market across 60+ geographies in the seven regions – Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa for the 27 major global industries. The report covers a ten year historic period – 2010-2021, and a ten year forecast period – 2023-2032.

 

Learn More On The 3D IC And 2.5D IC Packaging Market’s Growth:

https://www.thebusinessresearchcompany.com/report/3d-ic-and-2-5d-ic-packaging-global-market-report

The global 3D IC and 2.5D IC packaging market is expected to grow from $43.32 billion in 2022 to $48.60 billion in 2023 at a compound annual growth rate (CAGR) of 12.2%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The 3D IC and 2.5D IC packaging market is expected to reach $73.58 billion in 2027 at a CAGR of 10.9%.

 

Get A Free Sample Of The Report (Includes Graphs And Tables):
https://www.thebusinessresearchcompany.com/sample_request?id=12128&type=smp
Technological advancements are a key trend gaining popularity in the 3D IC and 2.5D IC packaging market. Major companies operating in the 3D IC and 2.5D IC packaging market are adopting new technologies to sustain their position in the market. For instance, in June 2022, ASE Technology Holding Co. Ltd., a Taiwan-based provider of semiconductor manufacturing services, launched VIPack, an advanced packaging platform designed to enable vertically integrated package solutions. It is the next generation of 3D heterogeneous integration architecture from ASE that expands design guidelines and delivers exceptionally high performance and density. The platform enables companies to achieve unparalleled creativity when integrating several chips into a single package. It utilizes advanced redistribution layer (RDL) technologies, embedded integration, and 2.5D and 3D technologies. Six fundamental packaging technology pillars comprise ASE’s VIPack, complemented by a wide-ranging co-design ecosystem. These include ASE’s high-density through Silicon Via (TSV)-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities, as well as Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP)-based technologies.

 

The 3d ic and 2.5d ic packaging market is segmented:

1) By Technology: 3D Wafer-Level Chip-Scale Packaging, 3D TSV (Through-Silicon Via), 2.5D
2) By Application: Logic, Memory, Imaging And Optoelectronics, MEMS Or Sensors, LED, Other Applications
3) By End-user: Telecommunication, Consumer Electronics, Automotive, Military And Aerospace, Medical Devices, Smart Technologies, Other End Users

Asia-Pacific  was the largest region in the 3d ic and 2.5d ic packaging market in 2022.

The table of contents in TBRC’s 3d ic and 2.5d ic packaging market report includes:
1. Executive Summary
2. 3D IC And 2.5D IC Packaging Market Characteristics
3. 3D IC And 2.5D IC Packaging Market Trends And Strategies
4. 3D IC And 2.5D IC Packaging Market – Macro Economic Scenario
…………………

  1. Global 3D IC And 2.5D IC Packaging Market Competitive Benchmarking
    33. Global 3D IC And 2.5D IC Packaging Market Competitive Dashboard
    34. Key Mergers And Acquisitions In The 3D IC And 2.5D IC Packaging Market
    35. 3D IC And 2.5D IC Packaging Market Future Outlook and Potential Analysis
    36. Appendix

 

Learn About Us:
The Business Research Company is a market intelligence firm that pioneers in market, company, and consumer research. TBRC’s specialist consultants are located globally and are experts in a wide range of industries that include healthcare, manufacturing, financial services, chemicals, and technology. The firm has offices located in the UK, the US, and India, along with a network of proficient researchers in 28 countries. Through the report businesses can gain a thorough understanding of the market’s size, growth rate, major drivers and leading players.

 

Contact Us:
The Business Research Company
Europe: +44 207 1930 708

Asia: +91 88972 63534

Americas: +1 315 623 0293

Email: [email protected]

 

Follow Us On:

LinkedIn: https://in.linkedin.com/company/the-business-research-company

Twitter: https://twitter.com/tbrc_info

Facebook: https://www.facebook.com/TheBusinessResearchCompany

YouTube: https://www.youtube.com/channel/UC24_fI0rV8cR5DxlCpgmyFQ

Blog: https://blog.tbrc.info/

Healthcare Blog: https://healthcareresearchreports.com/

Global Market Model: https://www.thebusinessresearchcompany.com/global-market-model